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Mobile World Congress
The MediaTek corporate logo features at the Fira Gran Via booth, representing the company's ''AI For Life: From Edge to Cloud'' strategy during the Mobile World Congress. The exhibit showcases the flagship Dimensity 9500 processor, built on TSMC's 3nm (N3P) process and featuring an All Big Core architecture with a Cortex-X925 ultra-core clocked at 3.73 GHz. The display highlights the new NPU 9.0 (Neural Processing Unit) delivering 100 TOPS of computing power for on-device generative video and agentic AI. The branding encompasses the Dimensity Auto MT2739 platform for satellite-connected vehicles and the first commercial Wi-Fi 8 solutions using the Filogic 8000 series, emphasizing MediaTek's leadership in high-speed, low-latency connectivity for smartphones, IoT, and next-generation data centers during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. (Photo by Joan Cros/NurPhoto)
Photo Details
| Photo ID | #13439927 |
|---|---|
| Date Taken | |
| Location | N/A |
| Photographer | Joan Cros/NurPhoto |
| Category | Science and Technology |
| Copyright | © 2026 NurPhoto - Joan Cros/NurPhoto |
Related Keywords
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2026 NurPhoto. All rights reserved.
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