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"ELECTRONICS CHIPS"

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Computer motherboards, semiconductors, and chips are in Shanghai, China, on July 4, 2025. (Photo by Costfoto/NurPhoto)

#12528064

US Lifts Restrictions on Chinese Chip EDA

4 July 2025

Computer motherboards, semiconductors, and chips are in Shanghai, China, on July 4, 2025. (Photo by Costfoto/NurPhoto)

#12528064

4 July 2025

Computer motherboards, semiconductors, and chips are in Shanghai, China, on July 4, 2025.


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Computer motherboards, semiconductors, and chips are in Shanghai, China, on July 4, 2025. (Photo by Costfoto/NurPhoto)

#12528065

US Lifts Restrictions on Chinese Chip EDA

4 July 2025

Computer motherboards, semiconductors, and chips are in Shanghai, China, on July 4, 2025. (Photo by Costfoto/NurPhoto)

#12528065

4 July 2025

Computer motherboards, semiconductors, and chips are in Shanghai, China, on July 4, 2025.


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Computer motherboards, semiconductors, and chips are in Shanghai, China, on July 4, 2025. (Photo by Costfoto/NurPhoto)

#12528067

US Lifts Restrictions on Chinese Chip EDA

4 July 2025

Computer motherboards, semiconductors, and chips are in Shanghai, China, on July 4, 2025. (Photo by Costfoto/NurPhoto)

#12528067

4 July 2025

Computer motherboards, semiconductors, and chips are in Shanghai, China, on July 4, 2025.


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Computer motherboards, semiconductors, and chips are in Shanghai, China, on July 4, 2025. (Photo by Costfoto/NurPhoto)

#12528068

US Lifts Restrictions on Chinese Chip EDA

4 July 2025

Computer motherboards, semiconductors, and chips are in Shanghai, China, on July 4, 2025. (Photo by Costfoto/NurPhoto)

#12528068

4 July 2025

Computer motherboards, semiconductors, and chips are in Shanghai, China, on July 4, 2025.


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Computer motherboards, semiconductors, and chips are in Shanghai, China, on July 4, 2025. (Photo by Costfoto/NurPhoto)

#12528070

US Lifts Restrictions on Chinese Chip EDA

4 July 2025

Computer motherboards, semiconductors, and chips are in Shanghai, China, on July 4, 2025. (Photo by Costfoto/NurPhoto)

#12528070

4 July 2025

Computer motherboards, semiconductors, and chips are in Shanghai, China, on July 4, 2025.


Restricted to Editorial Use Only.
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Computer motherboards, semiconductors, and chips are in Shanghai, China, on July 4, 2025. (Photo by Costfoto/NurPhoto)

#12528071

US Lifts Restrictions on Chinese Chip EDA

4 July 2025

Computer motherboards, semiconductors, and chips are in Shanghai, China, on July 4, 2025. (Photo by Costfoto/NurPhoto)

#12528071

4 July 2025

Computer motherboards, semiconductors, and chips are in Shanghai, China, on July 4, 2025.


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A robot hand holds a chip in front of office buildings at West Bund in Shanghai, China, on June 9, 2025. (Photo by Ying Tang/NurPhoto)

#12457407

Office Buildings At West Bund

9 June 2025

A robot hand holds a chip in front of office buildings at West Bund in Shanghai, China, on June 9, 2025. (Photo by Ying Tang/NurPhoto)

#12457407

9 June 2025

A robot hand holds a chip in front of office buildings at West Bund in Shanghai, China, on June 9, 2025.


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Several MediaTek chips from MediaTek Dimensity Auto Solutions, a range of new automotive solutions for car cockpits by the Taiwanese semicon...

#12227008

Mobile World Congress Barcelona 2025

23 May 2025

Several MediaTek chips from MediaTek Dimensity Auto Solutions, a range of new automotive solutions for car cockpits by the Taiwanese semicon...

#12227008

23 May 2025

Several MediaTek chips from MediaTek Dimensity Auto Solutions, a range of new automotive solutions for car cockpits by the Taiwanese semiconductor manufacturer, are exhibited during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025.


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Several Android smartphones equipped with MediaTek's chips, the Taiwanese semiconductor manufacturer, are displayed at their pavilion during...

#12227014

Mobile World Congress Barcelona 2025

23 May 2025

Several Android smartphones equipped with MediaTek's chips, the Taiwanese semiconductor manufacturer, are displayed at their pavilion during...

#12227014

23 May 2025

Several Android smartphones equipped with MediaTek's chips, the Taiwanese semiconductor manufacturer, are displayed at their pavilion during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025.


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The MediaTek logo, the Taiwanese semiconductor manufacturer specializing in chips for 5G and AI-powered devices, is displayed on their pavil...

#12227021

Mobile World Congress Barcelona 2025

23 May 2025

The MediaTek logo, the Taiwanese semiconductor manufacturer specializing in chips for 5G and AI-powered devices, is displayed on their pavil...

#12227021

23 May 2025

The MediaTek logo, the Taiwanese semiconductor manufacturer specializing in chips for 5G and AI-powered devices, is displayed on their pavilion over the slogan ''Powerful On Device AI in Your Pocket'' during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025.


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The Mediatek logo, the Taiwanese fabless semiconductor company that provides chips for wireless communications, high-definition television,...

#12227022

Mobile World Congress Barcelona 2025

23 May 2025

The Mediatek logo, the Taiwanese fabless semiconductor company that provides chips for wireless communications, high-definition television,...

#12227022

23 May 2025

The Mediatek logo, the Taiwanese fabless semiconductor company that provides chips for wireless communications, high-definition television, handheld mobile devices like smartphones or tablets, navigation systems, consumer multimedia products, and digital subscriber line services, is in their pavilion during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025.


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A woman from MediaTek shows two congressmen the difference between their new MediaTek Dimensity 9400 chip on an Android device and Apple's A...

#12227013

Mobile World Congress Barcelona 2025

23 May 2025

A woman from MediaTek shows two congressmen the difference between their new MediaTek Dimensity 9400 chip on an Android device and Apple's A...

#12227013

23 May 2025

A woman from MediaTek shows two congressmen the difference between their new MediaTek Dimensity 9400 chip on an Android device and Apple's A-series chip on an iPhone during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025.


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The Compal RML-NV2 Module chip, a chip by the Taiwanese company Compal and the semiconductor manufacturer MediaTek, is exhibited during the...

#12227019

Mobile World Congress Barcelona 2025

23 May 2025

The Compal RML-NV2 Module chip, a chip by the Taiwanese company Compal and the semiconductor manufacturer MediaTek, is exhibited during the...

#12227019

23 May 2025

The Compal RML-NV2 Module chip, a chip by the Taiwanese company Compal and the semiconductor manufacturer MediaTek, is exhibited during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025.


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An image of MediaTek's flagship chip, the MediaTek Dimensity 9400, an all-big core CPU designed for AI-equipped smartphones by the Taiwanese...

#12227024

Mobile World Congress Barcelona 2025

23 May 2025

An image of MediaTek's flagship chip, the MediaTek Dimensity 9400, an all-big core CPU designed for AI-equipped smartphones by the Taiwanese...

#12227024

23 May 2025

An image of MediaTek's flagship chip, the MediaTek Dimensity 9400, an all-big core CPU designed for AI-equipped smartphones by the Taiwanese semiconductor manufacturer, is displayed during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025.


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The Fibocom FG332, a 3GPP R17 module chip by the Chinese company together with the Taiwanese semiconductor manufacturer MediaTek designed fo...

#12227018

Mobile World Congress Barcelona 2025

23 May 2025

The Fibocom FG332, a 3GPP R17 module chip by the Chinese company together with the Taiwanese semiconductor manufacturer MediaTek designed fo...

#12227018

23 May 2025

The Fibocom FG332, a 3GPP R17 module chip by the Chinese company together with the Taiwanese semiconductor manufacturer MediaTek designed for 5G IoT applications, is exhibited during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025.


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A tri-folding screen is exhibited at the MediaTek pavilion as the Taiwanese company's new flagship chip, Dimensity 9400, includes support fo...

#12227017

Mobile World Congress Barcelona 2025

23 May 2025

A tri-folding screen is exhibited at the MediaTek pavilion as the Taiwanese company's new flagship chip, Dimensity 9400, includes support fo...

#12227017

23 May 2025

A tri-folding screen is exhibited at the MediaTek pavilion as the Taiwanese company's new flagship chip, Dimensity 9400, includes support for scaling content across extended screens at the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025.


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