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"CORE"
3,505 professional editorial images found
#13424870
9 March 2026
The CoreWeave logo appears on a smartphone screen in this photo illustration in Ontario, Canada, on March 9, 2026.
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#13424871
9 March 2026
The CoreWeave logo appears on a smartphone screen in this photo illustration in Ontario, Canada, on March 9, 2026.
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#13413436
7 March 2026
The Juancloud Smart Video Lock X9, a next-generation electronic door security system featuring 3D Structured Light Facial Recognition and a built-in 4-megapixel (2K) wide-angle camera, is exhibited highlighting its multi-core AI processor for sub-1 second biometric verification and the V380 Pro app integration for remote access management and real-time video intercom during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.
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#13413542
7 March 2026
The FC Barcelona corporate logo is displayed at the club's official booth in the Congress Square, highlighting the Barca Vision digital ecosystem and the integration of Web3 and GenAI technologies powered by Intel Xeon Platinum processors and NVIDIA H200 Tensor Core GPUs for real-time sports data visualization and immersive fan experiences, as the club showcases its latest Barca One streaming innovations and smart stadium solutions during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.
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#13413854
7 March 2026
A digital display at the Qualcomm booth features the slogan ''Driving 6G Technology'' at the Fira Gran Via, showcasing the company's vision for an AI-native wireless future. The exhibit highlights the transition from 5G-Advanced to 6G through three core pillars: advanced connectivity, wide-area sensing, and high-performance compute. It features the latest Giga-MIMO prototype operating in the 7-15 GHz upper mid-band spectrum with channels up to 400 MHz wide and the Qualcomm X105 5G Modem-RF, the industry's first 3GPP Release 19-ready system designed to support foundational 6G spectral efficiency and energy-saving AI algorithms during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.
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#13413350
7 March 2026
The TECNO Modular Phone Concept, an ultra-slim 4.9mm smartphone featuring Modular Magnetic Interconnection Technology and the Snapdragon 8 Elite Gen 5 platform, is exhibited with its stackable ecosystem, including a 50-megapixel action camera module and a 10-20x telephoto optical lens attachment, as the manufacturer demonstrates high-bandwidth mmWave connectivity between the core device and its hardware peripherals during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.
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#13413351
7 March 2026
The TECNO Modular Phone Concept, an ultra-slim 4.9mm smartphone featuring Modular Magnetic Interconnection Technology and the Snapdragon 8 Elite Gen 5 platform, is exhibited with its stackable ecosystem, including a 50-megapixel action camera module and a 10-20x telephoto optical lens attachment, as the manufacturer demonstrates high-bandwidth mmWave connectivity between the core device and its hardware peripherals during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.
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#13413352
7 March 2026
The TECNO Modular Phone Concept, an ultra-slim 4.9mm smartphone featuring Modular Magnetic Interconnection Technology and the Snapdragon 8 Elite Gen 5 platform, is exhibited with its stackable ecosystem, including a 50-megapixel action camera module and a 10-20x telephoto optical lens attachment, as the manufacturer demonstrates high-bandwidth mmWave connectivity between the core device and its hardware peripherals during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.
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#13413353
7 March 2026
The TECNO Modular Phone Concept, an ultra-slim 4.9mm smartphone featuring Modular Magnetic Interconnection Technology and the Snapdragon 8 Elite Gen 5 platform, is exhibited with its stackable ecosystem, including a 50-megapixel action camera module and a 10-20x telephoto optical lens attachment, as the manufacturer demonstrates high-bandwidth mmWave connectivity between the core device and its hardware peripherals during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.
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#13413354
7 March 2026
The TECNO Modular Phone Concept, an ultra-slim 4.9mm smartphone featuring Modular Magnetic Interconnection Technology and the Snapdragon 8 Elite Gen 5 platform, is exhibited with its stackable ecosystem, including a 50-megapixel action camera module and a 10-20x telephoto optical lens attachment, as the manufacturer demonstrates high-bandwidth mmWave connectivity between the core device and its hardware peripherals during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.
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#13413545
7 March 2026
An immersive installation celebrates the 120th anniversary of Leitat technological center and features a 55-inch LG Transparent OLED (T-OLED) display with a 120Hz refresh rate and 38% transparency. It shows a digital olive tree superimposed over a real olive tree in the background to symbolize the fusion of nature and technology. The setup utilizes an Intel Core Ultra 7 (Series 2) processor with an integrated NPU to manage real-time generative AI visuals and environmental data overlays during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.
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#13413553
7 March 2026
The AGIBOT G1, powered by Unitree, is a 1.30-meter-tall humanoid robot dressed in a professional waiter's outfit. It demonstrates its high-performance bipedal balance by carrying a tray with glasses in each hand. The robot features a 360-degree LiDAR sensor and a depth camera for precise obstacle avoidance. It is powered by an 8-core high-performance CPU and an optional NVIDIA Jetson Orin module, which provides up to 275 TOPS to execute its WorkGPT embodied AI model during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.
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#13413554
7 March 2026
The AGIBOT G1, powered by Unitree, is a 1.30-meter-tall humanoid robot dressed in a professional waiter's outfit. It demonstrates its high-performance bipedal balance by carrying a tray with glasses in each hand. The robot features a 360-degree LiDAR sensor and a depth camera for precise obstacle avoidance. It is powered by an 8-core high-performance CPU and an optional NVIDIA Jetson Orin module, which provides up to 275 TOPS to execute its WorkGPT embodied AI model during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.
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#13413652
7 March 2026
The complete lineup of UniFi Protect G6 cameras is showcased at the Ubiquiti exhibit during the Fira Gran Via, featuring the G6 Bullet, G6 Dome, and the flagship G6 PTZ with 4K Ultra HD resolution at 30fps. The system is powered by a Quad-core Arm Cortex-A53 based chip with a dedicated AI Multi-TOPS engine for advanced license plate recognition (LPR), facial identification, and animal detection. It highlights the 1/1.8'' 8-megapixel sensors and WiFi 6/PoE+ connectivity options across the enterprise-grade surveillance ecosystem during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.
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#13413654
7 March 2026
The UniFi G6 Pro Entry smart door station is exhibited at the Ubiquiti booth during the Fira Gran Via in Barcelona, Spain, on March 5, 2026. It features a dual-camera system with a 12-megapixel main sensor for facial recognition and an 8-megapixel package camera for ground-level monitoring. The device is powered by a Quad-core Arm Cortex-A53 based processor with a dedicated AI Multi-TOPS engine. It showcases a 3-inch capacitive touchscreen and an integrated NFC/BLE access reader compatible with Apple and Google Wallet for secure, contactless entry during the Mobile World Congress (MWC).
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#13413656
7 March 2026
A comprehensive display of UniFi Enterprise network solutions is featured at the Ubiquiti booth during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026. The display is led by the Enterprise Fortress Gateway (EFG), a multi-gigabit security gateway powered by a Quad-core ARM Neoverse N1 processor with 16GB of DDR4 RAM and 12.5 Gbps of IDS/IPS throughput. The setup includes the Pro Max 48 PoE switches with Etherlighting technology and the U7 Enterprise wall-mounted access points featuring WiFi 7 and 6 GHz support, demonstrating massive data handling for AI-driven enterprise environments.
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