"Electronic components"

#13406549

6 March 2026

A close-up view of the base unit of the TECNO Modular Magnetic Concept Phone (ATOM Edition) is on display at MWC 2026. The device showcases an industry-leading ultra-slim profile of just 4.9mm, achieved by relocating traditional internal components into external magnetic modules. The rear of the handset features a specialized Magnetic Interconnection surface with exposed contact points, allowing for seamless power and data transfer with various hardware attachments. Its minimalist silver finish and compact form factor represent a radical departure from traditional smartphone architecture, prioritizing a ''thin-and-light'' core that can be expanded on demand during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.

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#13405039

5 March 2026

A close-up of a printed circuit board (PCB).

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#13405028

5 March 2026

In this photo illustration, a close-up of a printed circuit board (PCB) is seen, while the AMD logo is displayed on a screen in the background. AMD develops CPUs and GPUs for many computing markets in Athens, Greece, on March 5, 2026.

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#13405029

5 March 2026

In this photo illustration, a close-up of a printed circuit board (PCB) is seen, while the Intel logo is displayed on a screen in the background. Intel designs and manufactures CPUs and other chips in Athens, Greece, on March 5, 2026.

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#13405035

5 March 2026

In this photo illustration, a close-up of a printed circuit board (PCB) is visible, while the ASML logo appears on a screen in the background. ASML supplies lithography systems used in semiconductor manufacturing.

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#13405037

5 March 2026

In this photo illustration, a close-up of a printed circuit board (PCB) is seen, while the Tokyo Electron logo is displayed on a screen in the background. Tokyo Electron manufactures equipment used in semiconductor production in Athens, Greece, on March 5, 2026.

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#13405038

5 March 2026

In this photo illustration, a close-up of a printed circuit board (PCB) is seen, while the Broadcom logo is displayed on a screen in the background. Broadcom develops chips for Wi-Fi and wireless connectivity.

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#13405032

5 March 2026

In Athens, Greece, on March 5, 2026, a close-up of a printed circuit board (PCB) is seen in this photo illustration, while the Samsung logo is displayed on a screen in the background. Samsung makes semiconductors, including memory chips like DRAM.

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#13405031

5 March 2026

In this photo illustration in Athens, Greece, on March 5, 2026, a close-up of a printed circuit board (PCB) is seen, while the Qualcomm logo is displayed on a screen in the background. Qualcomm is one of the biggest semiconductor companies making chipsets.

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#13405034

5 March 2026

In this photo illustration, a close-up of a printed circuit board (PCB) is seen, while the Applied Materials logo is displayed on a screen in the background. Applied Materials supplies equipment used in semiconductor manufacturing in Athens, Greece, on March 5, 2026.

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#13399800

4 March 2026

Workers work on a circuit breaker production line at Anhui Wangulian Electric Co., Ltd. in Fuyang City, Anhui Province, China, on March 4, 2026.

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#13399804

4 March 2026

Workers work on a circuit breaker production line at Anhui Wangulian Electric Co., Ltd. in Fuyang City, Anhui Province, China, on March 4, 2026.

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#13399805

4 March 2026

Workers work on a circuit breaker production line at Anhui Wangulian Electric Co., Ltd. in Fuyang City, Anhui Province, China, on March 4, 2026.

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#13399806

4 March 2026

Workers work on a circuit breaker production line at Anhui Wangulian Electric Co., Ltd. in Fuyang City, Anhui Province, China, on March 4, 2026.

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#13399807

4 March 2026

Workers work on a circuit breaker production line at Anhui Wangulian Electric Co., Ltd. in Fuyang City, Anhui Province, China, on March 4, 2026.

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#13399808

4 March 2026

Workers work on a circuit breaker production line at Anhui Wangulian Electric Co., Ltd. in Fuyang City, Anhui Province, China, on March 4, 2026.

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