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"Image capture"
11,319 professional editorial images found
#13472161
19 Mar 2026
A person smiles while smoking in an area associated with date molasses production, on January 22, 2026.
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#13472167
19 Mar 2026
A molasses seller looks at the sky with curiosity to observe birds on January 22, 2026.
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#13472168
19 Mar 2026
A person rests in the middle of a market, on January 22, 2026.
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#13465216
18 Mar 2026
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#13457265
16 Mar 2026
A detailed close-up photograph captures the sophisticated rear camera system of the white Xiaomi 17 Ultra flagship smartphone at the Xiaomi pavilion during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. The prominent circular module, developed in collaboration with Leica, features the Leica Summilux optical lens system. The primary camera utilizes a 50-megapixel 1-inch type Sony IMX989 sensor with a variable aperture of f/1.40 to f/4.0 and Optical Image Stabilization (OIS). Accompanying it are a 50-megapixel ultra-wide angle lens (f/1.8, 122? FOV), a 50-megapixel telephoto lens with 3.2x optical zoom (75mm equivalent, f/1.8, OIS), and a 50-megapixel periscope telephoto lens providing 5x optical zoom (120mm equivalent, f/2.5, OIS). The hardware is powered by the Qualcomm Snapdragon 8 Elite processor and optimized by the Xiaomi AISP 2.0 computational photography engine, supporting Leica Authentic and Leica Vibrant color modes.
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#13457266
16 Mar 2026
A detailed close-up photograph captures the sophisticated rear camera system of the white Xiaomi 17 Ultra flagship smartphone at the Xiaomi pavilion during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. The prominent circular module, developed in collaboration with Leica, features the Leica Summilux optical lens system. The primary camera utilizes a 50-megapixel 1-inch type Sony IMX989 sensor with a variable aperture of f/1.40 to f/4.0 and Optical Image Stabilization (OIS). Accompanying it are a 50-megapixel ultra-wide angle lens (f/1.8, 122? FOV), a 50-megapixel telephoto lens with 3.2x optical zoom (75mm equivalent, f/1.8, OIS), and a 50-megapixel periscope telephoto lens providing 5x optical zoom (120mm equivalent, f/2.5, OIS). The hardware is powered by the Qualcomm Snapdragon 8 Elite processor and optimized by the Xiaomi AISP 2.0 computational photography engine, supporting Leica Authentic and Leica Vibrant color modes.
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#13457267
16 Mar 2026
A detailed close-up photograph captures the sophisticated rear camera system of the white Xiaomi 17 Ultra flagship smartphone at the Xiaomi pavilion during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. The prominent circular module, developed in collaboration with Leica, features the Leica Summilux optical lens system. The primary camera utilizes a 50-megapixel 1-inch type Sony IMX989 sensor with a variable aperture of f/1.40 to f/4.0 and Optical Image Stabilization (OIS). Accompanying it are a 50-megapixel ultra-wide angle lens (f/1.8, 122? FOV), a 50-megapixel telephoto lens with 3.2x optical zoom (75mm equivalent, f/1.8, OIS), and a 50-megapixel periscope telephoto lens providing 5x optical zoom (120mm equivalent, f/2.5, OIS). The hardware is powered by the Qualcomm Snapdragon 8 Elite processor and optimized by the Xiaomi AISP 2.0 computational photography engine, supporting Leica Authentic and Leica Vibrant color modes.
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#13439924
13 Mar 2026
A reference smartphone powered by the MediaTek Dimensity 9500 chipset is displayed at the Fira Gran Via, demonstrating the ''Dimensity AI Telephoto'' generative imaging technology. The device features a specialized 200-megapixel Samsung ISOCELL HP5 main sensor and a 50-megapixel periscope telephoto lens with 5x optical and 100x digital zoom capabilities. The hardware utilizes the integrated NPU 890 and the Imagiq 10 ISP (Image Signal Processor) to execute real-time AI Super Resolution and generative texture reconstruction, which intelligently fills in missing visual data at high magnification levels. The exhibit highlights the chipset's All-Big-Core architecture, featuring the Cortex-X925 core running at 3.73 GHz, which manages the complex computational photography pipelines required for stable 4K video capture at 10x hybrid zoom during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.
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#13439925
13 Mar 2026
A reference smartphone powered by the MediaTek Dimensity 9500 chipset is displayed at the Fira Gran Via, demonstrating the ''Dimensity AI Telephoto'' generative imaging technology. The device features a specialized 200-megapixel Samsung ISOCELL HP5 main sensor and a 50-megapixel periscope telephoto lens with 5x optical and 100x digital zoom capabilities. The hardware utilizes the integrated NPU 890 and the Imagiq 10 ISP (Image Signal Processor) to execute real-time AI Super Resolution and generative texture reconstruction, which intelligently fills in missing visual data at high magnification levels. The exhibit highlights the chipset's All-Big-Core architecture, featuring the Cortex-X925 core running at 3.73 GHz, which manages the complex computational photography pipelines required for stable 4K video capture at 10x hybrid zoom during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.
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#13436259
12 Mar 2026
TOKYO, JAPAN - MARCH 8: A customer photographs a robot in a convenience store, in Tokyo, Japan, on March 8, 2026.
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#13432209
11 Mar 2026
The Reebok logo is seen on the street in Warsaw, Poland, on March 3, 2026.
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#13429788
11 Mar 2026
A frog camouflages near a garage opener in Delray Beach, Florida, on March 10, 2026.
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#13430197
11 Mar 2026
A cat is seen in Athens, Greece, on March 10, 2026
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#13428149
10 Mar 2026
The scene is in Athens, Greece, on March 10, 2026.
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#13425248
9 Mar 2026
The Burger King logo is seen on the street in Warsaw, Poland, on February 26, 2026.
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#13423800
9 Mar 2026
A spider walks on a thread of its web near the lake in Ajmer, India, on March 7, 2026.
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