"Ultra-slim"

#13413350

7 March 2026

The TECNO Modular Phone Concept, an ultra-slim 4.9mm smartphone featuring Modular Magnetic Interconnection Technology and the Snapdragon 8 Elite Gen 5 platform, is exhibited with its stackable ecosystem, including a 50-megapixel action camera module and a 10-20x telephoto optical lens attachment, as the manufacturer demonstrates high-bandwidth mmWave connectivity between the core device and its hardware peripherals during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13413351

7 March 2026

The TECNO Modular Phone Concept, an ultra-slim 4.9mm smartphone featuring Modular Magnetic Interconnection Technology and the Snapdragon 8 Elite Gen 5 platform, is exhibited with its stackable ecosystem, including a 50-megapixel action camera module and a 10-20x telephoto optical lens attachment, as the manufacturer demonstrates high-bandwidth mmWave connectivity between the core device and its hardware peripherals during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13413352

7 March 2026

The TECNO Modular Phone Concept, an ultra-slim 4.9mm smartphone featuring Modular Magnetic Interconnection Technology and the Snapdragon 8 Elite Gen 5 platform, is exhibited with its stackable ecosystem, including a 50-megapixel action camera module and a 10-20x telephoto optical lens attachment, as the manufacturer demonstrates high-bandwidth mmWave connectivity between the core device and its hardware peripherals during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13413353

7 March 2026

The TECNO Modular Phone Concept, an ultra-slim 4.9mm smartphone featuring Modular Magnetic Interconnection Technology and the Snapdragon 8 Elite Gen 5 platform, is exhibited with its stackable ecosystem, including a 50-megapixel action camera module and a 10-20x telephoto optical lens attachment, as the manufacturer demonstrates high-bandwidth mmWave connectivity between the core device and its hardware peripherals during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13413354

7 March 2026

The TECNO Modular Phone Concept, an ultra-slim 4.9mm smartphone featuring Modular Magnetic Interconnection Technology and the Snapdragon 8 Elite Gen 5 platform, is exhibited with its stackable ecosystem, including a 50-megapixel action camera module and a 10-20x telephoto optical lens attachment, as the manufacturer demonstrates high-bandwidth mmWave connectivity between the core device and its hardware peripherals during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13413890

7 March 2026

The Honor Magic V6 foldable smartphone is showcased at the Fira Gran Via in Barcelona, Spain, on March 5, 2026, featuring an ultra-slim 8.75mm chassis and a 7.95-inch LTPO 2.0 AMOLED internal display with a 120Hz refresh rate and 5,000 nits peak brightness. The device is powered by the Qualcomm Snapdragon 8 Elite Gen 5 processor with 16GB of LPDDR5X RAM and debuts the world's first IP68/IP69 dual-rated protection for foldables. The triple camera system includes a 50-megapixel main sensor (f/1.6) with OIS, a 64-megapixel periscope telephoto lens with CIPA 6.5 image stabilization, and a 50-megapixel ultra-wide lens, all supported by a massive 6,660mAh silicon-carbon battery and MagicOS 10 based on Android 16.

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#13413891

7 March 2026

The Honor Magic V6 foldable smartphone is showcased at the Fira Gran Via in Barcelona, Spain, on March 5, 2026, featuring an ultra-slim 8.75mm chassis and a 7.95-inch LTPO 2.0 AMOLED internal display with a 120Hz refresh rate and 5,000 nits peak brightness. The device is powered by the Qualcomm Snapdragon 8 Elite Gen 5 processor with 16GB of LPDDR5X RAM and debuts the world's first IP68/IP69 dual-rated protection for foldables. The triple camera system includes a 50-megapixel main sensor (f/1.6) with OIS, a 64-megapixel periscope telephoto lens with CIPA 6.5 image stabilization, and a 50-megapixel ultra-wide lens, all supported by a massive 6,660mAh silicon-carbon battery and MagicOS 10 based on Android 16.

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#13413892

7 March 2026

The Honor Magic V6 foldable smartphone is showcased at the Fira Gran Via in Barcelona, Spain, on March 5, 2026, featuring an ultra-slim 8.75mm chassis and a 7.95-inch LTPO 2.0 AMOLED internal display with a 120Hz refresh rate and 5,000 nits peak brightness. The device is powered by the Qualcomm Snapdragon 8 Elite Gen 5 processor with 16GB of LPDDR5X RAM and debuts the world's first IP68/IP69 dual-rated protection for foldables. The triple camera system includes a 50-megapixel main sensor (f/1.6) with OIS, a 64-megapixel periscope telephoto lens with CIPA 6.5 image stabilization, and a 50-megapixel ultra-wide lens, all supported by a massive 6,660mAh silicon-carbon battery and MagicOS 10 based on Android 16.

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#13413893

7 March 2026

The Honor Magic V6 foldable smartphone is showcased at the Fira Gran Via in Barcelona, Spain, on March 5, 2026, featuring an ultra-slim 8.75mm chassis and a 7.95-inch LTPO 2.0 AMOLED internal display with a 120Hz refresh rate and 5,000 nits peak brightness. The device is powered by the Qualcomm Snapdragon 8 Elite Gen 5 processor with 16GB of LPDDR5X RAM and debuts the world's first IP68/IP69 dual-rated protection for foldables. The triple camera system includes a 50-megapixel main sensor (f/1.6) with OIS, a 64-megapixel periscope telephoto lens with CIPA 6.5 image stabilization, and a 50-megapixel ultra-wide lens, all supported by a massive 6,660mAh silicon-carbon battery and MagicOS 10 based on Android 16.

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#13414178

7 March 2026

The Huawei MatePad Mini compact tablet is showcased at the Fira Gran Via in Barcelona, Spain, on March 5, 2026, featuring an 8.8-inch Flexible OLED PaperMatte display with a 2.5K (2560 x 1600) resolution, 120Hz refresh rate, and 1,800 nits peak brightness. The device is powered by the HiSilicon Kirin 9010 (or Kirin 9020) octa-core processor with 12GB of RAM and runs on HarmonyOS 5.1/6.0 with support for the HUAWEI M-Pencil Pro (2ms latency). It features a dual rear camera system with a 50-megapixel main sensor (f/1.8) and an 8-megapixel ultra-wide lens, along with a high-resolution 32-megapixel front camera for professional video conferencing. The tablet includes a 6,400mAh battery with 66W SuperCharge and introduces two-way BeiDou satellite messaging in a slim 5.1mm magnesium alloy body during the Mobile World Congress (MWC).

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#13413978

7 March 2026

The Huawei Mate X7 foldable smartphone is presented at the Fira Gran Via, featuring an 8-inch LTPO OLED internal display with 2,500 nits and a 6.49-inch quad-curved cover screen protected by second-generation Kunlun Glass. The device is powered by the HiSilicon Kirin 9030 Pro chipset (6nm) with 16GB of RAM and runs on HarmonyOS 6.0. It highlights its advanced XMAGE triple camera system with a 50-megapixel RYYB main sensor featuring a 10-stop variable aperture (f/1.4-f/4.0), a 50-megapixel periscope telephoto lens with 3.5x optical zoom and macro capabilities, and a 40-megapixel ultra-wide lens. The flagship includes a 5,600mAh silicon-carbon battery and supports dual-mode satellite connectivity for calling and messaging during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13413979

7 March 2026

The Huawei Mate X7 foldable smartphone is presented at the Fira Gran Via, featuring an 8-inch LTPO OLED internal display with 2,500 nits and a 6.49-inch quad-curved cover screen protected by second-generation Kunlun Glass. The device is powered by the HiSilicon Kirin 9030 Pro chipset (6nm) with 16GB of RAM and runs on HarmonyOS 6.0. It highlights its advanced XMAGE triple camera system with a 50-megapixel RYYB main sensor featuring a 10-stop variable aperture (f/1.4-f/4.0), a 50-megapixel periscope telephoto lens with 3.5x optical zoom and macro capabilities, and a 40-megapixel ultra-wide lens. The flagship includes a 5,600mAh silicon-carbon battery and supports dual-mode satellite connectivity for calling and messaging during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13413980

7 March 2026

The Huawei Mate X7 foldable smartphone is presented at the Fira Gran Via, featuring an 8-inch LTPO OLED internal display with 2,500 nits and a 6.49-inch quad-curved cover screen protected by second-generation Kunlun Glass. The device is powered by the HiSilicon Kirin 9030 Pro chipset (6nm) with 16GB of RAM and runs on HarmonyOS 6.0. It highlights its advanced XMAGE triple camera system with a 50-megapixel RYYB main sensor featuring a 10-stop variable aperture (f/1.4-f/4.0), a 50-megapixel periscope telephoto lens with 3.5x optical zoom and macro capabilities, and a 40-megapixel ultra-wide lens. The flagship includes a 5,600mAh silicon-carbon battery and supports dual-mode satellite connectivity for calling and messaging during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13414082

7 March 2026

The Huawei Mate XT Ultimate Design tri-foldable smartphone is showcased at the Fira Gran Via, featuring a revolutionary 10.2-inch 3K HUAWEI X-True OLED display that transitions through single (6.4''), dual (7.9''), and triple-screen modes with a 3184 x 2232 pixel resolution. The flagship is powered by the HiSilicon Kirin 9010 (7nm) octa-core processor with 16GB of RAM and debuts the Ultra Aperture XMAGE camera system led by a 50-megapixel main sensor with a 10-stop physical variable aperture (f/1.4-f/4.0) and OIS, a 12-megapixel periscope telephoto lens with 5.5x optical zoom, and a 12-megapixel ultra-wide lens. Measuring just 3.6mm thick when fully unfolded, it integrates a 5,600mAh ultra-thin silicon-carbon battery and supports two-way satellite communication during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13414084

7 March 2026

The Huawei Mate XT Ultimate Design tri-foldable smartphone is showcased at the Fira Gran Via, featuring a revolutionary 10.2-inch 3K HUAWEI X-True OLED display that transitions through single (6.4''), dual (7.9''), and triple-screen modes with a 3184 x 2232 pixel resolution. The flagship is powered by the HiSilicon Kirin 9010 (7nm) octa-core processor with 16GB of RAM and debuts the Ultra Aperture XMAGE camera system led by a 50-megapixel main sensor with a 10-stop physical variable aperture (f/1.4-f/4.0) and OIS, a 12-megapixel periscope telephoto lens with 5.5x optical zoom, and a 12-megapixel ultra-wide lens. Measuring just 3.6mm thick when fully unfolded, it integrates a 5,600mAh ultra-thin silicon-carbon battery and supports two-way satellite communication during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13406548

6 March 2026

A detailed view of the TECNO Modular Magnetic Concept Phone (MODA Edition) showcases at MWC 2026. The image highlights the revolutionary Modular Magnetic Interconnection Technology (MMIT), featuring the large-format Telephoto Lens Module docked onto the ultra-slim 4.9mm chassis. The module, which houses a dedicated high-resolution image sensor and a physical optical zoom assembly, transforms the minimalist smartphone into a high-performance imaging system. The sleek, industrial design of the hardware, with its exposed magnetic contact points and metallic finish, underscores the shift toward a customizable, modular future for mobile technology during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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