"external modules"

#13406549

6 March 2026

A close-up view of the base unit of the TECNO Modular Magnetic Concept Phone (ATOM Edition) is on display at MWC 2026. The device showcases an industry-leading ultra-slim profile of just 4.9mm, achieved by relocating traditional internal components into external magnetic modules. The rear of the handset features a specialized Magnetic Interconnection surface with exposed contact points, allowing for seamless power and data transfer with various hardware attachments. Its minimalist silver finish and compact form factor represent a radical departure from traditional smartphone architecture, prioritizing a ''thin-and-light'' core that can be expanded on demand during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.

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