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"flagship fair"
63 professional editorial images found
#12685243
28 August 2025
The Samsung Galaxy S25 Ultra, the top-tier smartphone of the high-end Android-based devices developed and marketed by the South Korean company Samsung Electronics, is exhibited in its signature color Titanium during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025.
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#12685244
28 August 2025
The Samsung Galaxy S25 Ultra, the top-tier smartphone of the high-end Android-based devices developed and marketed by the South Korean company Samsung Electronics, is exhibited in its signature color Titanium during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025.
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#12685245
28 August 2025
The Samsung Galaxy S25 Ultra, the top-tier smartphone of the high-end Android-based devices developed and marketed by the South Korean company Samsung Electronics, is exhibited in its signature color Titanium during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025.
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#12685247
28 August 2025
The Samsung Galaxy S25 Ultra, the top-tier smartphone of the high-end Android-based devices developed and marketed by the South Korean company Samsung Electronics, is exhibited in its signature color Titanium during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025.
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#12227024
23 May 2025
An image of MediaTek's flagship chip, the MediaTek Dimensity 9400, an all-big core CPU designed for AI-equipped smartphones by the Taiwanese semiconductor manufacturer, is displayed during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025.
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#12226812
23 May 2025
The RedMagic Cyberbuds DAO TWS, the flagship Qualcomm Bluetooth built for a faster and more stable connection by the gaming brand of the Chinese company Nubia, are exhibited during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025.
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#12226940
23 May 2025
The Realme 14 Pro 5G, the new flagship smartphone by the Chinese company filial of Oppo, is exhibited inside a water tank to demonstrate its high water-resistant properties during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025.
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#12226952
23 May 2025
The Realme 14 Pro + 5G, the latest top-tier flagship smartphone by the Chinese company filial of Oppo, features high underwater resistance and a triple flash camera. It is exhibited during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025.
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#12226959
23 May 2025
The Realme 14 Pro + 5G, the latest top-tier flagship smartphone by the Chinese company filial of Oppo, features high underwater resistance and a triple flash camera. It is exhibited in its signature white sand color during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025.
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#12226964
23 May 2025
The Realme 14 Pro + 5G, the latest top-tier flagship smartphone by the Chinese company filial of Oppo, features high underwater resistance and a triple flash camera. It is exhibited during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025.
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#12226967
23 May 2025
The Realme 14 Pro + 5G, the latest top-tier flagship smartphone by the Chinese company filial of Oppo, features high underwater resistance and a triple flash camera. It is exhibited during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025.
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#12226975
23 May 2025
The Realme 14 Pro + 5G, the latest top-tier flagship smartphone by the Chinese company filial of Oppo, features high underwater resistance and a triple flash camera. It is exhibited during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025.
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#12226986
23 May 2025
The Realme 14 Pro + 5G, the latest top-tier flagship smartphone by the Chinese company filial of Oppo, features high underwater resistance and a triple flash camera. It is exhibited during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025.
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#12227017
23 May 2025
A tri-folding screen is exhibited at the MediaTek pavilion as the Taiwanese company's new flagship chip, Dimensity 9400, includes support for scaling content across extended screens at the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025.
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#12397025
23 May 2025
A tri-folding screen is exhibited at the MediaTek pavilion as the Taiwanese company's new flagship chip, Dimensity 9400, includes support for scaling content across extended screens at the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025.
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#12397031
22 May 2025
An image of MediaTek's flagship chip, the MediaTek Dimensity 9400, an all-big core CPI designed for AI-equipped smartphones by the Taiwanese semiconductor manufacturer, is displayed during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025.
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