"moda"

#13448977

15 March 2026

Shawn Mendes arrives at the Gucci afterparty during the Milan Fashion Week Women's Fall/Winter 2026/2027 in Milan, Italy, on February 27, 2026.

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#13448982

15 March 2026

Laura Harrier, Kate Moss, and Edward Enninful arrive at the Gucci afterparty during the Milan Fashion Week Women's Fall/Winter 2026/2027 in Milan, Italy, on February 27, 2026.

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#13448987

15 March 2026

Kate Moss arrives at the Gucci afterparty during Milan Fashion Week Women's Fall/Winter 2026/2027 in Milan, Italy, on February 27, 2026.

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#13448989

15 March 2026

Romeo Beckham arrives at the Gucci afterparty during the Milan Fashion Week Women's Fall/Winter 2026/2027 in Milan, Italy, on February 27, 2026.

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#13448965

15 March 2026

Michele Morrone, an actor, arrives at the Dolce & Gabbana afterparty during Milan Fashion Week Women's Fall/Winter 2026/2027 in Milan, Italy, on March 1, 2026.

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#13448966

15 March 2026

Michele Morrone, an actor, arrives at the Dolce & Gabbana afterparty during Milan Fashion Week Women's Fall/Winter 2026/2027 in Milan, Italy, on March 1, 2026.

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#13448967

15 March 2026

Michele Morrone, an actor, arrives at the Dolce & Gabbana afterparty during Milan Fashion Week Women's Fall/Winter 2026/2027 in Milan, Italy, on March 1, 2026.

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#13448970

15 March 2026

Madonna and Akeem Morris arrive at the Dolce & Gabbana afterparty during Milan Fashion Week Women's Fall/Winter 2026/2027 in Milan, Italy, on March 1, 2026.

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#13448971

15 March 2026

Mina El Hammani, an actress, arrives at the Dolce & Gabbana afterparty during the Milan Fashion Week Women's Fall/Winter 2026/2027 in Milan, Italy, on March 1, 2026.

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#13448974

15 March 2026

Alberto Guerra, an actor, arrives at the Dolce & Gabbana afterparty during the Milan Fashion Week Women's Fall/Winter 2026/2027 in Milan, Italy, on March 1, 2026.

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#13413350

7 March 2026

The TECNO Modular Phone Concept, an ultra-slim 4.9mm smartphone featuring Modular Magnetic Interconnection Technology and the Snapdragon 8 Elite Gen 5 platform, is exhibited with its stackable ecosystem, including a 50-megapixel action camera module and a 10-20x telephoto optical lens attachment, as the manufacturer demonstrates high-bandwidth mmWave connectivity between the core device and its hardware peripherals during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13413351

7 March 2026

The TECNO Modular Phone Concept, an ultra-slim 4.9mm smartphone featuring Modular Magnetic Interconnection Technology and the Snapdragon 8 Elite Gen 5 platform, is exhibited with its stackable ecosystem, including a 50-megapixel action camera module and a 10-20x telephoto optical lens attachment, as the manufacturer demonstrates high-bandwidth mmWave connectivity between the core device and its hardware peripherals during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13413352

7 March 2026

The TECNO Modular Phone Concept, an ultra-slim 4.9mm smartphone featuring Modular Magnetic Interconnection Technology and the Snapdragon 8 Elite Gen 5 platform, is exhibited with its stackable ecosystem, including a 50-megapixel action camera module and a 10-20x telephoto optical lens attachment, as the manufacturer demonstrates high-bandwidth mmWave connectivity between the core device and its hardware peripherals during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13413353

7 March 2026

The TECNO Modular Phone Concept, an ultra-slim 4.9mm smartphone featuring Modular Magnetic Interconnection Technology and the Snapdragon 8 Elite Gen 5 platform, is exhibited with its stackable ecosystem, including a 50-megapixel action camera module and a 10-20x telephoto optical lens attachment, as the manufacturer demonstrates high-bandwidth mmWave connectivity between the core device and its hardware peripherals during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13413354

7 March 2026

The TECNO Modular Phone Concept, an ultra-slim 4.9mm smartphone featuring Modular Magnetic Interconnection Technology and the Snapdragon 8 Elite Gen 5 platform, is exhibited with its stackable ecosystem, including a 50-megapixel action camera module and a 10-20x telephoto optical lens attachment, as the manufacturer demonstrates high-bandwidth mmWave connectivity between the core device and its hardware peripherals during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13406548

6 March 2026

A detailed view of the TECNO Modular Magnetic Concept Phone (MODA Edition) showcases at MWC 2026. The image highlights the revolutionary Modular Magnetic Interconnection Technology (MMIT), featuring the large-format Telephoto Lens Module docked onto the ultra-slim 4.9mm chassis. The module, which houses a dedicated high-resolution image sensor and a physical optical zoom assembly, transforms the minimalist smartphone into a high-performance imaging system. The sleek, industrial design of the hardware, with its exposed magnetic contact points and metallic finish, underscores the shift toward a customizable, modular future for mobile technology during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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