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The NTT (Nippon Telegraph and Telephone) logo is prominently displayed at the joint exhibit featuring NTT, NTT DOCOMO, and NTT DATA during t...

#13439960

Mobile World Congress

13 March 2026

The NTT (Nippon Telegraph and Telephone) logo is prominently displayed at the joint exhibit featuring NTT, NTT DOCOMO, and NTT DATA during t...

#13439960

13 March 2026

The NTT (Nippon Telegraph and Telephone) logo is prominently displayed at the joint exhibit featuring NTT, NTT DOCOMO, and NTT DATA during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. Under the 2026 theme ''Photonics Unlocks an Intelligent Power-Optimized Future,'' the pavilion showcases the commercial evolution of the IOWN (Innovative Optical and Wireless Network) architecture. Key technical demonstrations include the All-Photonics Network (APN) and Photonics-Electronics Convergence (PEC) devices designed to reduce power consumption in AI data centers by up to 100x. The exhibit features hardware powered by the Qualcomm Snapdragon X105 NTN processor for satellite-to-terrestrial 5G integration and the NVIDIA Blackwell-based accelerated computing nodes for the ''GPU over APN'' solution, which enables high-speed, low-latency AI inference across distributed sites. The stand also highlights NTT DOCOMO's 6G ''Network for AI'' concept, utilizing real-time haptic feedback and autonomous robot control.


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The BWT Alpine A526 Formula 1 car is displayed at the Fira Gran Via in Barcelona, Spain, on March 5, 2026, marking the team's historic trans...

#13439901

Mobile World Congress

13 March 2026

The BWT Alpine A526 Formula 1 car is displayed at the Fira Gran Via in Barcelona, Spain, on March 5, 2026, marking the team's historic trans...

#13439901

13 March 2026

The BWT Alpine A526 Formula 1 car is displayed at the Fira Gran Via in Barcelona, Spain, on March 5, 2026, marking the team's historic transition to the Mercedes-AMG F1 M17 E PERFORMANCE power unit for the 2026 season. The challenger features a 1.6-liter V6 turbo engine redesigned for 100% sustainable fuels and a significantly uprated electric system, with the MGU-K output tripled to 350kW to achieve a 50/50 power split between thermal and electric energy. The all-new chassis is 200mm shorter and 100mm narrower than its predecessor, reducing total weight by 30kg to meet the new 768kg limit. The vehicle incorporates active aerodynamics with movable front and rear wings and serves as a real-world validation platform for the IndraMind sovereign AI platform, which manages complex data correlation and predictive race strategy.


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The Cisco corporate logo features prominently at the Fira Gran Via, highlighting the company's focus on AI-native networking and cybersecuri...

#13439921

Mobile World Congress

13 March 2026

The Cisco corporate logo features prominently at the Fira Gran Via, highlighting the company's focus on AI-native networking and cybersecuri...

#13439921

13 March 2026

The Cisco corporate logo features prominently at the Fira Gran Via, highlighting the company's focus on AI-native networking and cybersecurity during the Mobile World Congress. The exhibit showcases the Cisco Silicon One G200 and G202 processors, which power the next generation of high-density switches for AI back-end networks with up to 51.2 Tbps of switching capacity. The display highlights the integration of Cisco Hypershield and Splunk analytics for AI-driven threat detection and automated network management. Visitors explore the Cisco ThousandEyes platform for end-to-end visibility in 5G-Advanced and Wi-Fi 7 environments, while the pavilion emphasizes sustainable data center solutions using Liquid Cooling and Cisco UCS servers equipped with the latest Intel Xeon 6 processors during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.


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The Cisco corporate logo is seen at the Fira Gran Via, highlighting the company's focus on AI-ready infrastructure and integrated cybersecur...

#13439928

Mobile World Congress

13 March 2026

The Cisco corporate logo is seen at the Fira Gran Via, highlighting the company's focus on AI-ready infrastructure and integrated cybersecur...

#13439928

13 March 2026

The Cisco corporate logo is seen at the Fira Gran Via, highlighting the company's focus on AI-ready infrastructure and integrated cybersecurity solutions during the Mobile World Congress. The exhibit showcases the Cisco Silicon One G200 and G202 processors, which power high-density Ethernet switches with up to 51.2 Tbps of switching capacity to minimize latency in AI training clusters. The display features the integration of Cisco Hypershield and the Splunk observability platform, utilizing the NVIDIA BlueField-3 DPU for hardware-accelerated security and real-time threat detection. Visitors explore the Cisco UCS (Unified Computing System) servers equipped with Intel Xeon 6 processors, demonstrating liquid-cooling technologies and energy-efficient operations for the next generation of 5G-Advanced core networks during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.


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The BWT title partner logo is prominent on the pink and blue livery of the Alpine A526 Formula 1 car, exhibited at the Indra Group pavilion...

#13439900

Mobile World Congress

13 March 2026

The BWT title partner logo is prominent on the pink and blue livery of the Alpine A526 Formula 1 car, exhibited at the Indra Group pavilion...

#13439900

13 March 2026

The BWT title partner logo is prominent on the pink and blue livery of the Alpine A526 Formula 1 car, exhibited at the Indra Group pavilion in Hall 3 of the Fira Gran Via. The challenger for the 2026 season marks a radical shift in regulations, featuring the new Mercedes-AMG 1.6-liter V6 Turbo Hybrid power unit that delivers over 1,000 HP with a 50/50 split between thermal and electrical power (350kW MGU-K). The car showcases a 30kg weight reduction to 768kg and a more compact chassis (200mm shorter and 100mm narrower), integrating active aerodynamics with movable front and rear wings. Through its partnership with Indra, the vehicle serves as a demonstration platform for the IndraMind sovereign AI, which processes real-time race data and predictive analytics under extreme operational pressure during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.


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A detailed view of the front wing and nose cone of the BWT Alpine A526 Formula 1 car at the Fira Gran Via highlights the new Active Aerodyna...

#13439902

Mobile World Congress

13 March 2026

A detailed view of the front wing and nose cone of the BWT Alpine A526 Formula 1 car at the Fira Gran Via highlights the new Active Aerodyna...

#13439902

13 March 2026

A detailed view of the front wing and nose cone of the BWT Alpine A526 Formula 1 car at the Fira Gran Via highlights the new Active Aerodynamics flaps designed for the 2026 FIA technical regulations. The challenger, powered by the Mercedes-AMG F1 M17 E Performance V6 Turbo Hybrid unit, features a simplified front wing assembly with movable elements that adjust between Z-mode (high downforce) and X-mode (low drag). The chassis integrates the IndraMind sovereign AI platform to manage real-time sensor data from the front-end telemetry, optimizing the 50/50 power split between the internal combustion engine and the 350kW MGU-K electric motor. The front suspension utilizes a pull-rod configuration to minimize aerodynamic disruption, while the 18-inch wheels feature the new mandatory active rim covers for thermal management during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.


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A detailed view of the front wing and nose cone of the BWT Alpine A526 Formula 1 car at the Fira Gran Via highlights the new Active Aerodyna...

#13439903

Mobile World Congress

13 March 2026

A detailed view of the front wing and nose cone of the BWT Alpine A526 Formula 1 car at the Fira Gran Via highlights the new Active Aerodyna...

#13439903

13 March 2026

A detailed view of the front wing and nose cone of the BWT Alpine A526 Formula 1 car at the Fira Gran Via highlights the new Active Aerodynamics flaps designed for the 2026 FIA technical regulations. The challenger, powered by the Mercedes-AMG F1 M17 E Performance V6 Turbo Hybrid unit, features a simplified front wing assembly with movable elements that adjust between Z-mode (high downforce) and X-mode (low drag). The chassis integrates the IndraMind sovereign AI platform to manage real-time sensor data from the front-end telemetry, optimizing the 50/50 power split between the internal combustion engine and the 350kW MGU-K electric motor. The front suspension utilizes a pull-rod configuration to minimize aerodynamic disruption, while the 18-inch wheels feature the new mandatory active rim covers for thermal management during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.


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A detailed view of the front wing and nose cone of the BWT Alpine A526 Formula 1 car at the Fira Gran Via highlights the new Active Aerodyna...

#13439904

Mobile World Congress

13 March 2026

A detailed view of the front wing and nose cone of the BWT Alpine A526 Formula 1 car at the Fira Gran Via highlights the new Active Aerodyna...

#13439904

13 March 2026

A detailed view of the front wing and nose cone of the BWT Alpine A526 Formula 1 car at the Fira Gran Via highlights the new Active Aerodynamics flaps designed for the 2026 FIA technical regulations. The challenger, powered by the Mercedes-AMG F1 M17 E Performance V6 Turbo Hybrid unit, features a simplified front wing assembly with movable elements that adjust between Z-mode (high downforce) and X-mode (low drag). The chassis integrates the IndraMind sovereign AI platform to manage real-time sensor data from the front-end telemetry, optimizing the 50/50 power split between the internal combustion engine and the 350kW MGU-K electric motor. The front suspension utilizes a pull-rod configuration to minimize aerodynamic disruption, while the 18-inch wheels feature the new mandatory active rim covers for thermal management during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.


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The MediaTek corporate logo features at the Fira Gran Via booth, representing the company's ''AI For Life: From Edge to Cloud'' strategy dur...

#13439927

Mobile World Congress

13 March 2026

The MediaTek corporate logo features at the Fira Gran Via booth, representing the company's ''AI For Life: From Edge to Cloud'' strategy dur...

#13439927

13 March 2026

The MediaTek corporate logo features at the Fira Gran Via booth, representing the company's ''AI For Life: From Edge to Cloud'' strategy during the Mobile World Congress. The exhibit showcases the flagship Dimensity 9500 processor, built on TSMC's 3nm (N3P) process and featuring an All Big Core architecture with a Cortex-X925 ultra-core clocked at 3.73 GHz. The display highlights the new NPU 9.0 (Neural Processing Unit) delivering 100 TOPS of computing power for on-device generative video and agentic AI. The branding encompasses the Dimensity Auto MT2739 platform for satellite-connected vehicles and the first commercial Wi-Fi 8 solutions using the Filogic 8000 series, emphasizing MediaTek's leadership in high-speed, low-latency connectivity for smartphones, IoT, and next-generation data centers during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.


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The Starlink corporate logo, part of the SpaceX ecosystem, is seen against a clear blue sky at the Fira Gran Via in Barcelona, Spain, on Mar...

#13439930

Mobile World Congress

13 March 2026

The Starlink corporate logo, part of the SpaceX ecosystem, is seen against a clear blue sky at the Fira Gran Via in Barcelona, Spain, on Mar...

#13439930

13 March 2026

The Starlink corporate logo, part of the SpaceX ecosystem, is seen against a clear blue sky at the Fira Gran Via in Barcelona, Spain, on March 5, 2026. It represents the global expansion of the Starlink Gen2 satellite constellation during the Mobile World Congress. The exhibit showcases the new Starlink Standard Kit (V4) and the Flat High Performance terminal, powered by a custom quad-core ARM-based Starlink SoC designed for low-power beamforming and phased-array antenna management. The branding highlights the commercial launch of Direct-to-Cell services, utilizing the LTE/5G-Advanced spectrum to provide emergency messaging and data connectivity directly to unmodified smartphones through eNodeB satellite payloads. Visitors explore the integration of the Starlink Mobility platform with Wi-Fi 7 routers, offering download speeds exceeding 300 Mbps and latencies below 25ms for remote industrial and maritime applications.


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The Xiaomi Mijia Fresh Air Conditioner Pro Dual-Outlet Vertical 3HP showcases at the Xiaomi ''Human x Car x Home'' pavilion during the Mobil...

#13439967

Mobile World Congress

13 March 2026

The Xiaomi Mijia Fresh Air Conditioner Pro Dual-Outlet Vertical 3HP showcases at the Xiaomi ''Human x Car x Home'' pavilion during the Mobil...

#13439967

13 March 2026

The Xiaomi Mijia Fresh Air Conditioner Pro Dual-Outlet Vertical 3HP showcases at the Xiaomi ''Human x Car x Home'' pavilion during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. This premium floor-standing unit features a revolutionary dual-outlet design with a 160-degree ultra-wide angle air supply and a massive fresh air volume of 245 m3/h, capable of purifying a 40-square-meter room in just 24 minutes. The system is powered by the Lingyun Intelligent Control Engine and integrated with Xiaomi HyperOS Connect, utilizing a dedicated AI energy-saving chip to reduce power consumption by up to 40% compared to traditional 3HP models. The hardware includes a HEPA 4-layer filtration system with a 99% antibacterial rate and a high-performance full DC inverter compressor that supports extreme temperature operations from -32?C to 60?C. The display highlights its ''Star Satin Silver'' metallic finish and integrated centrifugal turbo fan technology, which maintains indoor CO2 levels at optimal levels.


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The new Xiaomi Smart Double Stack Air Fryer 12L showcases at the Xiaomi pavilion during the Mobile World Congress in Barcelona, Spain, on Ma...

#13439963

Mobile World Congress

13 March 2026

The new Xiaomi Smart Double Stack Air Fryer 12L showcases at the Xiaomi pavilion during the Mobile World Congress in Barcelona, Spain, on Ma...

#13439963

13 March 2026

The new Xiaomi Smart Double Stack Air Fryer 12L showcases at the Xiaomi pavilion during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. This innovative kitchen appliance features a unique vertical dual-basket architecture with a combined 12-liter capacity, allowing for the simultaneous preparation of up to four different dishes across its multi-layer racks. The device is powered by a high-efficiency 2800W heating system with 360-degree hot air circulation, managed by a dedicated Xiaomi HyperOS integrated controller that enables synchronized ''Finish-at-the-same-time'' (SYNC) logic for both baskets. The hardware includes a high-definition color LCD touchscreen on the front panel and is equipped with dual NTC high-precision temperature sensors to maintain a wide thermal range from 40?C to 230?C. Fully integrated into the Mi Home app, the unit supports 14 preset cooking modes and over 100 cloud-based smart recipes, demonstrating Xiaomi's expanded AIoT portfolio for the modern smart home.


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The new Xiaomi Smart Double Stack Air Fryer 12L showcases at the Xiaomi pavilion during the Mobile World Congress in Barcelona, Spain, on Ma...

#13439964

Mobile World Congress

13 March 2026

The new Xiaomi Smart Double Stack Air Fryer 12L showcases at the Xiaomi pavilion during the Mobile World Congress in Barcelona, Spain, on Ma...

#13439964

13 March 2026

The new Xiaomi Smart Double Stack Air Fryer 12L showcases at the Xiaomi pavilion during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. This innovative kitchen appliance features a unique vertical dual-basket architecture with a combined 12-liter capacity, allowing for the simultaneous preparation of up to four different dishes across its multi-layer racks. The device is powered by a high-efficiency 2800W heating system with 360-degree hot air circulation, managed by a dedicated Xiaomi HyperOS integrated controller that enables synchronized ''Finish-at-the-same-time'' (SYNC) logic for both baskets. The hardware includes a high-definition color LCD touchscreen on the front panel and is equipped with dual NTC high-precision temperature sensors to maintain a wide thermal range from 40?C to 230?C. Fully integrated into the Mi Home app, the unit supports 14 preset cooking modes and over 100 cloud-based smart recipes, demonstrating Xiaomi's expanded AIoT portfolio for the modern smart home.


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The Nexperia logo is displayed on a smartphone screen in this photo illustration, as tensions between the Dutch chipmaker and its Chinese su...

#13426903

Nexperia - Photo Illustration

10 March 2026

The Nexperia logo is displayed on a smartphone screen in this photo illustration, as tensions between the Dutch chipmaker and its Chinese su...

#13426903

10 March 2026

The Nexperia logo is displayed on a smartphone screen in this photo illustration, as tensions between the Dutch chipmaker and its Chinese subsidiary raise concerns about potential disruptions to the global semiconductor supply chain in Brussels, Belgium, on March 10, 2026.


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The Nexperia logo is displayed on a smartphone screen in this photo illustration, as tensions between the Dutch chipmaker and its Chinese su...

#13426905

Nexperia - Photo Illustration

10 March 2026

The Nexperia logo is displayed on a smartphone screen in this photo illustration, as tensions between the Dutch chipmaker and its Chinese su...

#13426905

10 March 2026

The Nexperia logo is displayed on a smartphone screen in this photo illustration, as tensions between the Dutch chipmaker and its Chinese subsidiary raise concerns about potential disruptions to the global semiconductor supply chain in Brussels, Belgium, on March 10, 2026.


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The Nexperia logo is displayed on a smartphone screen in this photo illustration, as tensions between the Dutch chipmaker and its Chinese su...

#13426908

Nexperia - Photo Illustration

10 March 2026

The Nexperia logo is displayed on a smartphone screen in this photo illustration, as tensions between the Dutch chipmaker and its Chinese su...

#13426908

10 March 2026

The Nexperia logo is displayed on a smartphone screen in this photo illustration, as tensions between the Dutch chipmaker and its Chinese subsidiary raise concerns about potential disruptions to the global semiconductor supply chain in Brussels, Belgium, on March 10, 2026.


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Commercial use is not permitted without prior authorization.
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