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"active cooling chip"
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#11362751
26 June 2024
The world's first solid-state active cooling chip, which is waterproof, is being pictured at the 2024 Mobile World Congress (MWC Shanghai) in Shanghai, China, on June 26, 2024.
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#11362750
26 June 2024
Exhibitors are demonstrating the world's first solid-state active cooling chip at the 2024 Mobile World Congress (MWC Shanghai) in Shanghai, China, on June 26, 2024.
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Commercial use is not permitted without prior authorization.
Please contact us for more information.