"low tech"

#13439896

13 March 2026

The AI Data Center (AIDC) logo is showcased at the SK Telecom pavilion in Hall 3 of the Fira Gran Via, representing the backbone of the company's ''AI Pyramid Strategy'' during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. The exhibit features the latest SAPEON X330 AI semiconductors and NVIDIA H200 Tensor Core GPUs integrated into a high-density server architecture. The display highlights SKT's proprietary Immersion Cooling technology and the AI Cloud Management Platform (CMP) designed to optimize large language model (LLM) workloads like the A.X K1. The infrastructure serves as the foundation for GPU-as-a-Service (GaaS) and sovereign AI solutions, enabling low-latency processing for 5G-Advanced and future 6G network applications.

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#13439902

13 March 2026

A detailed view of the front wing and nose cone of the BWT Alpine A526 Formula 1 car at the Fira Gran Via highlights the new Active Aerodynamics flaps designed for the 2026 FIA technical regulations. The challenger, powered by the Mercedes-AMG F1 M17 E Performance V6 Turbo Hybrid unit, features a simplified front wing assembly with movable elements that adjust between Z-mode (high downforce) and X-mode (low drag). The chassis integrates the IndraMind sovereign AI platform to manage real-time sensor data from the front-end telemetry, optimizing the 50/50 power split between the internal combustion engine and the 350kW MGU-K electric motor. The front suspension utilizes a pull-rod configuration to minimize aerodynamic disruption, while the 18-inch wheels feature the new mandatory active rim covers for thermal management during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13439903

13 March 2026

A detailed view of the front wing and nose cone of the BWT Alpine A526 Formula 1 car at the Fira Gran Via highlights the new Active Aerodynamics flaps designed for the 2026 FIA technical regulations. The challenger, powered by the Mercedes-AMG F1 M17 E Performance V6 Turbo Hybrid unit, features a simplified front wing assembly with movable elements that adjust between Z-mode (high downforce) and X-mode (low drag). The chassis integrates the IndraMind sovereign AI platform to manage real-time sensor data from the front-end telemetry, optimizing the 50/50 power split between the internal combustion engine and the 350kW MGU-K electric motor. The front suspension utilizes a pull-rod configuration to minimize aerodynamic disruption, while the 18-inch wheels feature the new mandatory active rim covers for thermal management during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13439904

13 March 2026

A detailed view of the front wing and nose cone of the BWT Alpine A526 Formula 1 car at the Fira Gran Via highlights the new Active Aerodynamics flaps designed for the 2026 FIA technical regulations. The challenger, powered by the Mercedes-AMG F1 M17 E Performance V6 Turbo Hybrid unit, features a simplified front wing assembly with movable elements that adjust between Z-mode (high downforce) and X-mode (low drag). The chassis integrates the IndraMind sovereign AI platform to manage real-time sensor data from the front-end telemetry, optimizing the 50/50 power split between the internal combustion engine and the 350kW MGU-K electric motor. The front suspension utilizes a pull-rod configuration to minimize aerodynamic disruption, while the 18-inch wheels feature the new mandatory active rim covers for thermal management during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13439926

13 March 2026

The UniFi brand logo is showcased at the Ubiquiti booth in Hall 2 of the Fira Gran Via, highlighting the company's ''IT Simplified'' philosophy during the Mobile World Congress. The exhibit features the latest Cloud Gateway Max and Enterprise Fortress Gateway (EFG), powered by an 8-core ARM Cortex-A57 processor at 2.5 GHz, designed to handle 25Gbps routing with full inspection. The display showcases the U7 Pro Max access points, which utilize the 6 GHz band with Wi-Fi 7 technology and Multi-Link Operation (MLO) for ultra-low latency. The branding emphasizes the integration of UniFi Protect AI-driven surveillance, featuring the G5 Pro cameras with 12-megapixel 4K sensors and advanced human/vehicle recognition running locally on the UniFi OS ecosystem without cloud dependence during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.

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#13439958

13 March 2026

A scale model of the Starlink V2 (Gen 2) satellite is on display at the T-Mobile (Deutsche Telekom) exhibition booth during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. The mockup represents the next-generation low-Earth orbit (LEO) spacecraft designed for Direct-to-Cell connectivity, featuring massive phased array antennas and custom-designed silicon. This hardware allows unmodified 5G smartphones, powered by modems like the Qualcomm Snapdragon X80 or the Snapdragon X105 NTN, to connect directly to the satellite network for text, voice, and data services. The Starlink V2 satellites used in the T-Mobile partnership integrate eNodeB technology in space, effectively acting as cell towers in orbit to eliminate coverage ''dead zones'' across Europe and the US. The model highlights the deployable solar arrays and the advanced radio frequency (RF) system designed to support high-density traffic and emergency 5G-Advanced services.

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#13439960

13 March 2026

The NTT (Nippon Telegraph and Telephone) logo is prominently displayed at the joint exhibit featuring NTT, NTT DOCOMO, and NTT DATA during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. Under the 2026 theme ''Photonics Unlocks an Intelligent Power-Optimized Future,'' the pavilion showcases the commercial evolution of the IOWN (Innovative Optical and Wireless Network) architecture. Key technical demonstrations include the All-Photonics Network (APN) and Photonics-Electronics Convergence (PEC) devices designed to reduce power consumption in AI data centers by up to 100x. The exhibit features hardware powered by the Qualcomm Snapdragon X105 NTN processor for satellite-to-terrestrial 5G integration and the NVIDIA Blackwell-based accelerated computing nodes for the ''GPU over APN'' solution, which enables high-speed, low-latency AI inference across distributed sites. The stand also highlights NTT DOCOMO's 6G ''Network for AI'' concept, utilizing real-time haptic feedback and autonomous robot control.

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#13439965

13 March 2026

A perspective view of the Xiaomi Mijia Semi-automatic Espresso Machine (model CME003) is showcased as part of the Xiaomi smart home ecosystem during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. This ultra-slim appliance, measuring just 14cm in width, features a professional 20 Bar high-pressure Italian pump and a 1350W heating element. The device is equipped with an NTC precise temperature control system and professional low-pressure pre-infusion technology to ensure optimal flavor extraction and a rich crema. The hardware includes a stainless steel housing, a 0.9-liter removable water tank, and a high-performance 8mm rotary steam wand for milk frothing. Managed via an intuitive touch interface, the machine allows for customizable cup volumes (40ml/80ml) and is integrated into the Xiaomi HyperOS environment for status monitoring and maintenance alerts through the Mi Home app.

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#13439905

13 March 2026

An attendee interacts with a high-fidelity AI Holographic Avatar at the Fira Gran Via, demonstrating the latest advancements in volumetric video capture and generative AI video production. The system utilizes a dedicated array of 21 Intel RealSense depth cameras and is powered by the NVIDIA GH200 Grace Hopper Superchip to process over 70 gigabits of raw data per second in real-time. The exhibit showcases the A.X K1 hyperscale AI model (or Telefonica's Edge-based AI), which allows for instant AI Avatar customization, including voice synthesis and emotional mapping. The 3D hologram is projected via a holographic mist display or transparent OLED panel, enabling a seamless ''Digital Twin'' experience with ultra-low latency supported by 5G-Advanced (5G-A) connectivity and MEC (Multi-access Edge Computing) during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13439908

13 March 2026

The Snapdragon corporate logo is illuminated at the Qualcomm pavilion in Hall 3 of the Fira Gran Via, representing the launch of the Snapdragon 8 Elite Gen 5 (SM8850-AC) mobile platform during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. The 3nm architecture processor features the new Oryon V3 CPU and an enhanced Hexagon NPU capable of delivering over 80 TOPS for on-device generative AI. The branding highlights the expansion of the Snapdragon ecosystem into automotive with the Snapdragon Cockpit Elite and computing with the Snapdragon X Elite Gen 2, which powers the latest Windows 11 Copilot+ PCs. The exhibit showcases seamless multimodal AI processing across smartphones, XR glasses, and connected vehicles, emphasizing the Qualcomm AI Stack and ultra-low latency 5G-Advanced connectivity through the Snapdragon X85 Modem-RF System.

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#13439914

13 March 2026

An On-Delivery autonomous delivery robot navigates the Nokia booth at the Fira Gran Via, demonstrating integrated 5G-Advanced logistics solutions during the Mobile World Congress. The robot is equipped with a 360-degree LiDAR system and a specialized 12-megapixel HDR wide-angle camera for obstacle recognition and semantic segmentation. Powered by the NVIDIA Jetson Orin Nano AI edge module and connected via a Nokia Industrial 5G router with the ReefShark chipset, the vehicle showcases real-time path planning and autonomous navigation through crowded environments. The demonstration highlights the Nokia Digital Automation Cloud (DAC) platform, which manages the robot's fleet telemetry and mission-critical low-latency communication with a response time of less than 5ms during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.

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#13439915

13 March 2026

A digital display at the Nokia booth showcases the Vadiio Generative AI dashboard, visualizing real-time traffic light synchronization and On-Delivery autonomous route optimization at the Fira Gran Via. The system is powered by the NVIDIA Blackwell HGX B200 server architecture at the edge, processing multimodal data through Nokia's AVA (Adaptive Virtual Assistant) autonomous operations software. The interface demonstrates how generative AI models, running on Intel Xeon 6 processors with vRAN Boost, analyze live video feeds from 48-megapixel smart city sensors to adjust delivery paths and signal timings. The demonstration highlights the integration of the ReefShark SoC for ultra-low latency data transmission, ensuring that On-Delivery robots, equipped with NVIDIA Jetson Orin modules, receive path updates in less than 10ms to avoid congestion during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13439917

13 March 2026

A live demonstration of the Vadiio Generative AI platform performs a semantic search for a ''person carrying a child'' across multiple security feeds at the Fira Gran Via. The system analyzes 4K video streams from Nokia i-Pro smart cameras equipped with 20-megapixel sensors, utilizing the NVIDIA Blackwell B200 GPU architecture for real-time natural language processing (NLP) of visual data. Powered by Intel Xeon 6 processors with vRAN Boost, the interface showcases how generative AI replaces traditional manual scrubbing with instant metadata filtering. The setup highlights the Nokia ReefShark SoC for ultra-low latency data backhaul and the Nokia AVA (Adaptive Virtual Assistant) framework, enabling complex object and behavioral recognition within a secure Sovereign AI environment during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13439927

13 March 2026

The MediaTek corporate logo features at the Fira Gran Via booth, representing the company's ''AI For Life: From Edge to Cloud'' strategy during the Mobile World Congress. The exhibit showcases the flagship Dimensity 9500 processor, built on TSMC's 3nm (N3P) process and featuring an All Big Core architecture with a Cortex-X925 ultra-core clocked at 3.73 GHz. The display highlights the new NPU 9.0 (Neural Processing Unit) delivering 100 TOPS of computing power for on-device generative video and agentic AI. The branding encompasses the Dimensity Auto MT2739 platform for satellite-connected vehicles and the first commercial Wi-Fi 8 solutions using the Filogic 8000 series, emphasizing MediaTek's leadership in high-speed, low-latency connectivity for smartphones, IoT, and next-generation data centers during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.

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#13439930

13 March 2026

The Starlink corporate logo, part of the SpaceX ecosystem, is seen against a clear blue sky at the Fira Gran Via in Barcelona, Spain, on March 5, 2026. It represents the global expansion of the Starlink Gen2 satellite constellation during the Mobile World Congress. The exhibit showcases the new Starlink Standard Kit (V4) and the Flat High Performance terminal, powered by a custom quad-core ARM-based Starlink SoC designed for low-power beamforming and phased-array antenna management. The branding highlights the commercial launch of Direct-to-Cell services, utilizing the LTE/5G-Advanced spectrum to provide emergency messaging and data connectivity directly to unmodified smartphones through eNodeB satellite payloads. Visitors explore the integration of the Starlink Mobility platform with Wi-Fi 7 routers, offering download speeds exceeding 300 Mbps and latencies below 25ms for remote industrial and maritime applications.

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#13439938

13 March 2026

The Honor HyperBot humanoid robot performs a synchronized dance routine with two professional dancers at the Fira Gran Via, surrounded by a crowd of attendees capturing the moment with their smartphones during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. The robot's agile movements and real-time synchronization are powered by the Qualcomm Robotics RB5 Platform, utilizing an integrated NPU for advanced motion control and environment sensing. Equipped with a multimodal sensor array, including a 12-megapixel Intel RealSense depth camera and a high-resolution 2D 5-megapixel camera for facial tracking, the HyperBot demonstrates seamless human-robot interaction over a low-latency 5G-Advanced network. The demonstration highlights Honor's expansion into AI-driven robotics and its MagicOS ecosystem integration, showcasing the robot's ability to interpret and respond to complex behavioral cues within a high-density environment.

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