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A woman holds RayNeo smart glasses at the TCL booth during the second day of the AWE 2026 trade fair at SNIEC in Shanghai, China, on March 1...

#13441594

AWE 2026 Trade Fair In Shanghai

13 March 2026

A woman holds RayNeo smart glasses at the TCL booth during the second day of the AWE 2026 trade fair at SNIEC in Shanghai, China, on March 1...

#13441594

13 March 2026

A woman holds RayNeo smart glasses at the TCL booth during the second day of the AWE 2026 trade fair at SNIEC in Shanghai, China, on March 13, 2026.


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An attendee holds the Samsung Galaxy S26 Ultra flagship smartphone at the Fira Gran Via. The device showcases a 6.9-inch Dynamic AMOLED 2X '...

#13439889

Mobile World Congress

13 March 2026

An attendee holds the Samsung Galaxy S26 Ultra flagship smartphone at the Fira Gran Via. The device showcases a 6.9-inch Dynamic AMOLED 2X '...

#13439889

13 March 2026

An attendee holds the Samsung Galaxy S26 Ultra flagship smartphone at the Fira Gran Via. The device showcases a 6.9-inch Dynamic AMOLED 2X ''Privacy Display'' with a 3120 x 1440 resolution and a 120Hz refresh rate. Powered by the Qualcomm Snapdragon 8 Elite Gen 5 for Galaxy processor with 16GB of LPDDR5X RAM, the smartphone features a professional quad-camera array led by a 200-megapixel main sensor (f/1.4 aperture) and a 50-megapixel periscope telephoto lens with 5x optical zoom and f/2.9 aperture. Running on Android 16 with One UI 8.5, the device integrates advanced Galaxy AI features and a 5,000mAh battery supporting 60W Super Fast Charging 3.0 during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.


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An attendee holds the Samsung Galaxy S26 Ultra flagship smartphone at the Fira Gran Via. The device showcases a 6.9-inch Dynamic AMOLED 2X '...

#13439890

Mobile World Congress

13 March 2026

An attendee holds the Samsung Galaxy S26 Ultra flagship smartphone at the Fira Gran Via. The device showcases a 6.9-inch Dynamic AMOLED 2X '...

#13439890

13 March 2026

An attendee holds the Samsung Galaxy S26 Ultra flagship smartphone at the Fira Gran Via. The device showcases a 6.9-inch Dynamic AMOLED 2X ''Privacy Display'' with a 3120 x 1440 resolution and a 120Hz refresh rate. Powered by the Qualcomm Snapdragon 8 Elite Gen 5 for Galaxy processor with 16GB of LPDDR5X RAM, the smartphone features a professional quad-camera array led by a 200-megapixel main sensor (f/1.4 aperture) and a 50-megapixel periscope telephoto lens with 5x optical zoom and f/2.9 aperture. Running on Android 16 with One UI 8.5, the device integrates advanced Galaxy AI features and a 5,000mAh battery supporting 60W Super Fast Charging 3.0 during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.


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A reference smartphone powered by the MediaTek Dimensity 9500 chipset is displayed at the Fira Gran Via, demonstrating the ''Dimensity AI Te...

#13439924

Mobile World Congress

13 March 2026

A reference smartphone powered by the MediaTek Dimensity 9500 chipset is displayed at the Fira Gran Via, demonstrating the ''Dimensity AI Te...

#13439924

13 March 2026

A reference smartphone powered by the MediaTek Dimensity 9500 chipset is displayed at the Fira Gran Via, demonstrating the ''Dimensity AI Telephoto'' generative imaging technology. The device features a specialized 200-megapixel Samsung ISOCELL HP5 main sensor and a 50-megapixel periscope telephoto lens with 5x optical and 100x digital zoom capabilities. The hardware utilizes the integrated NPU 890 and the Imagiq 10 ISP (Image Signal Processor) to execute real-time AI Super Resolution and generative texture reconstruction, which intelligently fills in missing visual data at high magnification levels. The exhibit highlights the chipset's All-Big-Core architecture, featuring the Cortex-X925 core running at 3.73 GHz, which manages the complex computational photography pipelines required for stable 4K video capture at 10x hybrid zoom during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.


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A reference smartphone powered by the MediaTek Dimensity 9500 chipset is displayed at the Fira Gran Via, demonstrating the ''Dimensity AI Te...

#13439925

Mobile World Congress

13 March 2026

A reference smartphone powered by the MediaTek Dimensity 9500 chipset is displayed at the Fira Gran Via, demonstrating the ''Dimensity AI Te...

#13439925

13 March 2026

A reference smartphone powered by the MediaTek Dimensity 9500 chipset is displayed at the Fira Gran Via, demonstrating the ''Dimensity AI Telephoto'' generative imaging technology. The device features a specialized 200-megapixel Samsung ISOCELL HP5 main sensor and a 50-megapixel periscope telephoto lens with 5x optical and 100x digital zoom capabilities. The hardware utilizes the integrated NPU 890 and the Imagiq 10 ISP (Image Signal Processor) to execute real-time AI Super Resolution and generative texture reconstruction, which intelligently fills in missing visual data at high magnification levels. The exhibit highlights the chipset's All-Big-Core architecture, featuring the Cortex-X925 core running at 3.73 GHz, which manages the complex computational photography pipelines required for stable 4K video capture at 10x hybrid zoom during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.


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The Xiaomi 17 Pro Max flagship smartphone is presented at the Fira Gran Via, showcasing its expansive 6.9-inch LTPO AMOLED main display with...

#13439881

Mobile World Congress

13 March 2026

The Xiaomi 17 Pro Max flagship smartphone is presented at the Fira Gran Via, showcasing its expansive 6.9-inch LTPO AMOLED main display with...

#13439881

13 March 2026

The Xiaomi 17 Pro Max flagship smartphone is presented at the Fira Gran Via, showcasing its expansive 6.9-inch LTPO AMOLED main display with 3,500 nits peak brightness and a secondary 2.9-inch AMOLED rear screen integrated into the Leica camera module. The device is powered by the Qualcomm Snapdragon 8 Elite Gen 5 (3nm) processor with 16GB of LPDDR5X RAM and runs on HyperOS 3 (Android 16). The Leica-tuned triple camera system features a 50-megapixel Light Fusion 950L main sensor (f/1.67), a 50-megapixel periscope telephoto lens with 5x optical zoom and OIS, and a 50-megapixel ultra-wide lens, all supported by a class-leading 7,500mAh silicon-carbon battery with 100W wired charging during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.


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An attendee holds the Samsung Galaxy S26 Ultra at the Fira Gran Via, showcasing the redesigned quad-camera system featuring a 200-megapixel...

#13439891

Mobile World Congress

13 March 2026

An attendee holds the Samsung Galaxy S26 Ultra at the Fira Gran Via, showcasing the redesigned quad-camera system featuring a 200-megapixel...

#13439891

13 March 2026

An attendee holds the Samsung Galaxy S26 Ultra at the Fira Gran Via, showcasing the redesigned quad-camera system featuring a 200-megapixel main sensor (f/1.4 aperture, 23mm) with OIS and a 50-megapixel periscope telephoto lens supporting 5x optical zoom (f/2.9 aperture). The flagship device is powered by the Qualcomm Snapdragon 8 Elite Gen 5 for Galaxy (3nm) processor and includes a 50-megapixel ultra-wide sensor (f/1.9) and a secondary 10-megapixel telephoto lens (3x optical). The rear panel highlights the new Satin Finish glass on a refined 7.9mm titanium-reinforced frame, while the device's ProVisual Engine and Galaxy AI manage real-time computational photography and 8K/30fps video recording during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.


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The Samsung Galaxy Z TriFold smartphone is displayed at the Fira Gran Via in Barcelona, Spain, on March 5, 2026, featuring a 10-inch Dynamic...

#13439882

Mobile World Congress

13 March 2026

The Samsung Galaxy Z TriFold smartphone is displayed at the Fira Gran Via in Barcelona, Spain, on March 5, 2026, featuring a 10-inch Dynamic...

#13439882

13 March 2026

The Samsung Galaxy Z TriFold smartphone is displayed at the Fira Gran Via in Barcelona, Spain, on March 5, 2026, featuring a 10-inch Dynamic AMOLED 2X main display with a 2160 x 1584 resolution and a 6.5-inch cover screen protected by Corning Gorilla Glass Ceramic 2. The device is powered by the Qualcomm Snapdragon 8 Elite for Galaxy (3nm) processor with 16GB of LPDDR5X RAM and runs on One UI 8.0 (Android 16). The professional-grade triple camera system includes a 200-megapixel main sensor (f/1.7) with OIS, a 12-megapixel ultra-wide lens, and a 10-megapixel telephoto lens with 3x optical zoom. The three-cell 5,600mAh battery supports 45W Super Fast Charging 2.0 in a chassis that measures 3.9mm at its thinnest point during the Mobile World Congress (MWC).


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The Samsung Galaxy Z TriFold smartphone is displayed at the Fira Gran Via in Barcelona, Spain, on March 5, 2026, featuring a 10-inch Dynamic...

#13439883

Mobile World Congress

13 March 2026

The Samsung Galaxy Z TriFold smartphone is displayed at the Fira Gran Via in Barcelona, Spain, on March 5, 2026, featuring a 10-inch Dynamic...

#13439883

13 March 2026

The Samsung Galaxy Z TriFold smartphone is displayed at the Fira Gran Via in Barcelona, Spain, on March 5, 2026, featuring a 10-inch Dynamic AMOLED 2X main display with a 2160 x 1584 resolution and a 6.5-inch cover screen protected by Corning Gorilla Glass Ceramic 2. The device is powered by the Qualcomm Snapdragon 8 Elite for Galaxy (3nm) processor with 16GB of LPDDR5X RAM and runs on One UI 8.0 (Android 16). The professional-grade triple camera system includes a 200-megapixel main sensor (f/1.7) with OIS, a 12-megapixel ultra-wide lens, and a 10-megapixel telephoto lens with 3x optical zoom. The three-cell 5,600mAh battery supports 45W Super Fast Charging 2.0 in a chassis that measures 3.9mm at its thinnest point during the Mobile World Congress (MWC).


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The NTT (Nippon Telegraph and Telephone) logo is prominently displayed at the joint exhibit featuring NTT, NTT DOCOMO, and NTT DATA during t...

#13439960

Mobile World Congress

13 March 2026

The NTT (Nippon Telegraph and Telephone) logo is prominently displayed at the joint exhibit featuring NTT, NTT DOCOMO, and NTT DATA during t...

#13439960

13 March 2026

The NTT (Nippon Telegraph and Telephone) logo is prominently displayed at the joint exhibit featuring NTT, NTT DOCOMO, and NTT DATA during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. Under the 2026 theme ''Photonics Unlocks an Intelligent Power-Optimized Future,'' the pavilion showcases the commercial evolution of the IOWN (Innovative Optical and Wireless Network) architecture. Key technical demonstrations include the All-Photonics Network (APN) and Photonics-Electronics Convergence (PEC) devices designed to reduce power consumption in AI data centers by up to 100x. The exhibit features hardware powered by the Qualcomm Snapdragon X105 NTN processor for satellite-to-terrestrial 5G integration and the NVIDIA Blackwell-based accelerated computing nodes for the ''GPU over APN'' solution, which enables high-speed, low-latency AI inference across distributed sites. The stand also highlights NTT DOCOMO's 6G ''Network for AI'' concept, utilizing real-time haptic feedback and autonomous robot control.


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The Samsung Galaxy S26 Ultra, Galaxy S26+, and Galaxy S26 flagship smartphones display together at the Fira Gran Via, showcasing the lineup'...

#13439884

Mobile World Congress

13 March 2026

The Samsung Galaxy S26 Ultra, Galaxy S26+, and Galaxy S26 flagship smartphones display together at the Fira Gran Via, showcasing the lineup'...

#13439884

13 March 2026

The Samsung Galaxy S26 Ultra, Galaxy S26+, and Galaxy S26 flagship smartphones display together at the Fira Gran Via, showcasing the lineup's new design language and the Snapdragon 8 Elite Gen 5 for Galaxy (3nm) or Exynos 2600 (2nm) processors. The premium Galaxy S26 Ultra features a 6.9-inch Dynamic AMOLED 2X Privacy Display and a quad-camera system led by a 200-megapixel main sensor (f/1.4) and a 50-megapixel 5x periscope telephoto lens. The Galaxy S26+ and Galaxy S26, with 6.7-inch and 6.3-inch displays respectively, utilize a triple camera setup with a 50-megapixel wide lens (f/1.8), a 12-megapixel ultra-wide, and a 10-megapixel 3x telephoto sensor. All three models integrate Galaxy AI enhancements and the ProVisual Engine for advanced nightography and real-time horizontal lock during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.


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The TECNO Modular Phone Concept, an ultra-slim 4.9mm smartphone featuring Modular Magnetic Interconnection Technology and the Snapdragon 8 E...

#13413350

Mobile World Congress

7 March 2026

The TECNO Modular Phone Concept, an ultra-slim 4.9mm smartphone featuring Modular Magnetic Interconnection Technology and the Snapdragon 8 E...

#13413350

7 March 2026

The TECNO Modular Phone Concept, an ultra-slim 4.9mm smartphone featuring Modular Magnetic Interconnection Technology and the Snapdragon 8 Elite Gen 5 platform, is exhibited with its stackable ecosystem, including a 50-megapixel action camera module and a 10-20x telephoto optical lens attachment, as the manufacturer demonstrates high-bandwidth mmWave connectivity between the core device and its hardware peripherals during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.


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The TECNO Modular Phone Concept, an ultra-slim 4.9mm smartphone featuring Modular Magnetic Interconnection Technology and the Snapdragon 8 E...

#13413351

Mobile World Congress

7 March 2026

The TECNO Modular Phone Concept, an ultra-slim 4.9mm smartphone featuring Modular Magnetic Interconnection Technology and the Snapdragon 8 E...

#13413351

7 March 2026

The TECNO Modular Phone Concept, an ultra-slim 4.9mm smartphone featuring Modular Magnetic Interconnection Technology and the Snapdragon 8 Elite Gen 5 platform, is exhibited with its stackable ecosystem, including a 50-megapixel action camera module and a 10-20x telephoto optical lens attachment, as the manufacturer demonstrates high-bandwidth mmWave connectivity between the core device and its hardware peripherals during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.


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The TECNO Modular Phone Concept, an ultra-slim 4.9mm smartphone featuring Modular Magnetic Interconnection Technology and the Snapdragon 8 E...

#13413352

Mobile World Congress

7 March 2026

The TECNO Modular Phone Concept, an ultra-slim 4.9mm smartphone featuring Modular Magnetic Interconnection Technology and the Snapdragon 8 E...

#13413352

7 March 2026

The TECNO Modular Phone Concept, an ultra-slim 4.9mm smartphone featuring Modular Magnetic Interconnection Technology and the Snapdragon 8 Elite Gen 5 platform, is exhibited with its stackable ecosystem, including a 50-megapixel action camera module and a 10-20x telephoto optical lens attachment, as the manufacturer demonstrates high-bandwidth mmWave connectivity between the core device and its hardware peripherals during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.


Restricted to Editorial Use Only.
Commercial use is not permitted without prior authorization.
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The TECNO Modular Phone Concept, an ultra-slim 4.9mm smartphone featuring Modular Magnetic Interconnection Technology and the Snapdragon 8 E...

#13413353

Mobile World Congress

7 March 2026

The TECNO Modular Phone Concept, an ultra-slim 4.9mm smartphone featuring Modular Magnetic Interconnection Technology and the Snapdragon 8 E...

#13413353

7 March 2026

The TECNO Modular Phone Concept, an ultra-slim 4.9mm smartphone featuring Modular Magnetic Interconnection Technology and the Snapdragon 8 Elite Gen 5 platform, is exhibited with its stackable ecosystem, including a 50-megapixel action camera module and a 10-20x telephoto optical lens attachment, as the manufacturer demonstrates high-bandwidth mmWave connectivity between the core device and its hardware peripherals during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.


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Commercial use is not permitted without prior authorization.
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The TECNO Modular Phone Concept, an ultra-slim 4.9mm smartphone featuring Modular Magnetic Interconnection Technology and the Snapdragon 8 E...

#13413354

Mobile World Congress

7 March 2026

The TECNO Modular Phone Concept, an ultra-slim 4.9mm smartphone featuring Modular Magnetic Interconnection Technology and the Snapdragon 8 E...

#13413354

7 March 2026

The TECNO Modular Phone Concept, an ultra-slim 4.9mm smartphone featuring Modular Magnetic Interconnection Technology and the Snapdragon 8 Elite Gen 5 platform, is exhibited with its stackable ecosystem, including a 50-megapixel action camera module and a 10-20x telephoto optical lens attachment, as the manufacturer demonstrates high-bandwidth mmWave connectivity between the core device and its hardware peripherals during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.


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