"time high"

#13439905

13 March 2026

An attendee interacts with a high-fidelity AI Holographic Avatar at the Fira Gran Via, demonstrating the latest advancements in volumetric video capture and generative AI video production. The system utilizes a dedicated array of 21 Intel RealSense depth cameras and is powered by the NVIDIA GH200 Grace Hopper Superchip to process over 70 gigabits of raw data per second in real-time. The exhibit showcases the A.X K1 hyperscale AI model (or Telefonica's Edge-based AI), which allows for instant AI Avatar customization, including voice synthesis and emotional mapping. The 3D hologram is projected via a holographic mist display or transparent OLED panel, enabling a seamless ''Digital Twin'' experience with ultra-low latency supported by 5G-Advanced (5G-A) connectivity and MEC (Multi-access Edge Computing) during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13439902

13 March 2026

A detailed view of the front wing and nose cone of the BWT Alpine A526 Formula 1 car at the Fira Gran Via highlights the new Active Aerodynamics flaps designed for the 2026 FIA technical regulations. The challenger, powered by the Mercedes-AMG F1 M17 E Performance V6 Turbo Hybrid unit, features a simplified front wing assembly with movable elements that adjust between Z-mode (high downforce) and X-mode (low drag). The chassis integrates the IndraMind sovereign AI platform to manage real-time sensor data from the front-end telemetry, optimizing the 50/50 power split between the internal combustion engine and the 350kW MGU-K electric motor. The front suspension utilizes a pull-rod configuration to minimize aerodynamic disruption, while the 18-inch wheels feature the new mandatory active rim covers for thermal management during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13439903

13 March 2026

A detailed view of the front wing and nose cone of the BWT Alpine A526 Formula 1 car at the Fira Gran Via highlights the new Active Aerodynamics flaps designed for the 2026 FIA technical regulations. The challenger, powered by the Mercedes-AMG F1 M17 E Performance V6 Turbo Hybrid unit, features a simplified front wing assembly with movable elements that adjust between Z-mode (high downforce) and X-mode (low drag). The chassis integrates the IndraMind sovereign AI platform to manage real-time sensor data from the front-end telemetry, optimizing the 50/50 power split between the internal combustion engine and the 350kW MGU-K electric motor. The front suspension utilizes a pull-rod configuration to minimize aerodynamic disruption, while the 18-inch wheels feature the new mandatory active rim covers for thermal management during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13439904

13 March 2026

A detailed view of the front wing and nose cone of the BWT Alpine A526 Formula 1 car at the Fira Gran Via highlights the new Active Aerodynamics flaps designed for the 2026 FIA technical regulations. The challenger, powered by the Mercedes-AMG F1 M17 E Performance V6 Turbo Hybrid unit, features a simplified front wing assembly with movable elements that adjust between Z-mode (high downforce) and X-mode (low drag). The chassis integrates the IndraMind sovereign AI platform to manage real-time sensor data from the front-end telemetry, optimizing the 50/50 power split between the internal combustion engine and the 350kW MGU-K electric motor. The front suspension utilizes a pull-rod configuration to minimize aerodynamic disruption, while the 18-inch wheels feature the new mandatory active rim covers for thermal management during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13439928

13 March 2026

The Cisco corporate logo is seen at the Fira Gran Via, highlighting the company's focus on AI-ready infrastructure and integrated cybersecurity solutions during the Mobile World Congress. The exhibit showcases the Cisco Silicon One G200 and G202 processors, which power high-density Ethernet switches with up to 51.2 Tbps of switching capacity to minimize latency in AI training clusters. The display features the integration of Cisco Hypershield and the Splunk observability platform, utilizing the NVIDIA BlueField-3 DPU for hardware-accelerated security and real-time threat detection. Visitors explore the Cisco UCS (Unified Computing System) servers equipped with Intel Xeon 6 processors, demonstrating liquid-cooling technologies and energy-efficient operations for the next generation of 5G-Advanced core networks during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.

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#13439932

13 March 2026

The Meta corporate logo is featured at the Fira Gran Via booth, highlighting the company's ''AI-First'' hardware ecosystem during the Mobile World Congress. The exhibit showcases the Ray-Ban Meta Display (Gen 3) smart glasses, which feature a 12-megapixel ultra-wide camera for multimodal AI environment analysis and a micro-LED heads-up display etched into the right lens. The hardware is powered by the Qualcomm Snapdragon AR1 Gen 2 platform, enabling real-time language translation and ''Look and Ask'' visual search via the Llama 4 model. The display also features the Meta Quest 4 (codenamed ''Pismo High''), which utilizes the Snapdragon XR2 Gen 3 chipset and dual 24-megapixel 4K passthrough cameras for high-fidelity mixed reality experiences. The booth demonstrates the Neural Band (EMG) wearable for gesture-based control and the prototype Orion AR glasses with a 70-degree field of view and silicon carbide lenses during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.

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#13439915

13 March 2026

A digital display at the Nokia booth showcases the Vadiio Generative AI dashboard, visualizing real-time traffic light synchronization and On-Delivery autonomous route optimization at the Fira Gran Via. The system is powered by the NVIDIA Blackwell HGX B200 server architecture at the edge, processing multimodal data through Nokia's AVA (Adaptive Virtual Assistant) autonomous operations software. The interface demonstrates how generative AI models, running on Intel Xeon 6 processors with vRAN Boost, analyze live video feeds from 48-megapixel smart city sensors to adjust delivery paths and signal timings. The demonstration highlights the integration of the ReefShark SoC for ultra-low latency data transmission, ensuring that On-Delivery robots, equipped with NVIDIA Jetson Orin modules, receive path updates in less than 10ms to avoid congestion during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13439916

13 March 2026

A digital interface at the Nokia booth displays the Vaidio Generative AI video analytics platform, which monitors multiple security feeds at the Fira Gran Via during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. The system integrates live streams from Nokia i-Pro smart cameras featuring 20-megapixel sensors and 4K resolution, processed through the NVIDIA Blackwell B200 GPU architecture located at the network edge. Powered by Intel Xeon 6 processors with vRAN Boost technology, the software utilizes Semantic Vision models to identify and track objects across disparate camera angles in real-time. The exhibit demonstrates the synergy between the Nokia ReefShark SoC for high-speed data backhaul and Vaidio's autonomous reasoning engine, which enables natural language querying of visual metadata to enhance public safety and crowd management.

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#13439924

13 March 2026

A reference smartphone powered by the MediaTek Dimensity 9500 chipset is displayed at the Fira Gran Via, demonstrating the ''Dimensity AI Telephoto'' generative imaging technology. The device features a specialized 200-megapixel Samsung ISOCELL HP5 main sensor and a 50-megapixel periscope telephoto lens with 5x optical and 100x digital zoom capabilities. The hardware utilizes the integrated NPU 890 and the Imagiq 10 ISP (Image Signal Processor) to execute real-time AI Super Resolution and generative texture reconstruction, which intelligently fills in missing visual data at high magnification levels. The exhibit highlights the chipset's All-Big-Core architecture, featuring the Cortex-X925 core running at 3.73 GHz, which manages the complex computational photography pipelines required for stable 4K video capture at 10x hybrid zoom during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.

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#13439925

13 March 2026

A reference smartphone powered by the MediaTek Dimensity 9500 chipset is displayed at the Fira Gran Via, demonstrating the ''Dimensity AI Telephoto'' generative imaging technology. The device features a specialized 200-megapixel Samsung ISOCELL HP5 main sensor and a 50-megapixel periscope telephoto lens with 5x optical and 100x digital zoom capabilities. The hardware utilizes the integrated NPU 890 and the Imagiq 10 ISP (Image Signal Processor) to execute real-time AI Super Resolution and generative texture reconstruction, which intelligently fills in missing visual data at high magnification levels. The exhibit highlights the chipset's All-Big-Core architecture, featuring the Cortex-X925 core running at 3.73 GHz, which manages the complex computational photography pipelines required for stable 4K video capture at 10x hybrid zoom during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.

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#13439938

13 March 2026

The Honor HyperBot humanoid robot performs a synchronized dance routine with two professional dancers at the Fira Gran Via, surrounded by a crowd of attendees capturing the moment with their smartphones during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. The robot's agile movements and real-time synchronization are powered by the Qualcomm Robotics RB5 Platform, utilizing an integrated NPU for advanced motion control and environment sensing. Equipped with a multimodal sensor array, including a 12-megapixel Intel RealSense depth camera and a high-resolution 2D 5-megapixel camera for facial tracking, the HyperBot demonstrates seamless human-robot interaction over a low-latency 5G-Advanced network. The demonstration highlights Honor's expansion into AI-driven robotics and its MagicOS ecosystem integration, showcasing the robot's ability to interpret and respond to complex behavioral cues within a high-density environment.

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#13439956

13 March 2026

In Barcelona, Spain, on March 5, 2026, a detailed view of a 5G-connected smart ambulance backpack designed for first responders is featured at the GSMA Foundry pavilion. The tactical medical kit integrates a rugged Panasonic Toughbook G3 tablet, which serves as the central command hub powered by the Qualcomm Snapdragon 8 Gen 5 processor. The system is equipped with a 50-megapixel ultra-wide camera with low-light optimization for remote teleconsultation and real-time triage. The tablet's interface displays live telemetry from integrated IoT smart sensors, including a wearable ECG patch, a wireless pulse oximeter, and a 256x192 thermal imaging sensor for locating victims in low-visibility environments. Utilizing 5G-Advanced network slicing for prioritized data transmission, the kit allows paramedics to synchronize vital signs and high-definition video feeds directly with hospital emergency rooms during the Mobile World Congress (MWC).

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#13439959

13 March 2026

The HelixNorth DBX (Digital Box) autonomous drone system is on display during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. This specialized UAV (Unmanned Aerial Vehicle) is designed for automated industrial inspections and emergency response, featuring a high-performance dual-sensor payload with a 64-megapixel RGB camera and a 640x512 radiometric thermal sensor for heat signature detection. The aircraft is powered by the NVIDIA Jetson Orin Nano edge AI processor, enabling real-time object recognition and obstacle avoidance without cloud dependency. Integrated with 5G-Advanced connectivity via the Qualcomm Snapdragon X80 modem, the HelixNorth system supports ultra-low latency remote piloting and live 4K video streaming to command centers. The unit shown includes the ''Drone-in-a-Box'' docking station, which provides automated charging and weather protection for the 1.5 kg carbon-fiber airframe.

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#13439960

13 March 2026

The NTT (Nippon Telegraph and Telephone) logo is prominently displayed at the joint exhibit featuring NTT, NTT DOCOMO, and NTT DATA during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. Under the 2026 theme ''Photonics Unlocks an Intelligent Power-Optimized Future,'' the pavilion showcases the commercial evolution of the IOWN (Innovative Optical and Wireless Network) architecture. Key technical demonstrations include the All-Photonics Network (APN) and Photonics-Electronics Convergence (PEC) devices designed to reduce power consumption in AI data centers by up to 100x. The exhibit features hardware powered by the Qualcomm Snapdragon X105 NTN processor for satellite-to-terrestrial 5G integration and the NVIDIA Blackwell-based accelerated computing nodes for the ''GPU over APN'' solution, which enables high-speed, low-latency AI inference across distributed sites. The stand also highlights NTT DOCOMO's 6G ''Network for AI'' concept, utilizing real-time haptic feedback and autonomous robot control.

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#13439963

13 March 2026

The new Xiaomi Smart Double Stack Air Fryer 12L showcases at the Xiaomi pavilion during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. This innovative kitchen appliance features a unique vertical dual-basket architecture with a combined 12-liter capacity, allowing for the simultaneous preparation of up to four different dishes across its multi-layer racks. The device is powered by a high-efficiency 2800W heating system with 360-degree hot air circulation, managed by a dedicated Xiaomi HyperOS integrated controller that enables synchronized ''Finish-at-the-same-time'' (SYNC) logic for both baskets. The hardware includes a high-definition color LCD touchscreen on the front panel and is equipped with dual NTC high-precision temperature sensors to maintain a wide thermal range from 40?C to 230?C. Fully integrated into the Mi Home app, the unit supports 14 preset cooking modes and over 100 cloud-based smart recipes, demonstrating Xiaomi's expanded AIoT portfolio for the modern smart home.

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#13439964

13 March 2026

The new Xiaomi Smart Double Stack Air Fryer 12L showcases at the Xiaomi pavilion during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. This innovative kitchen appliance features a unique vertical dual-basket architecture with a combined 12-liter capacity, allowing for the simultaneous preparation of up to four different dishes across its multi-layer racks. The device is powered by a high-efficiency 2800W heating system with 360-degree hot air circulation, managed by a dedicated Xiaomi HyperOS integrated controller that enables synchronized ''Finish-at-the-same-time'' (SYNC) logic for both baskets. The hardware includes a high-definition color LCD touchscreen on the front panel and is equipped with dual NTC high-precision temperature sensors to maintain a wide thermal range from 40?C to 230?C. Fully integrated into the Mi Home app, the unit supports 14 preset cooking modes and over 100 cloud-based smart recipes, demonstrating Xiaomi's expanded AIoT portfolio for the modern smart home.

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