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Mobile World Congress

The MediaTek corporate logo is displayed at the Fira Gran Via booth with the slogan ''Complete End-to-End Solutions,'' highlighting the company's ''AI For Life'' ecosystem during the Mobile World Congress. The exhibit features the flagship Dimensity 9500 processor, built on a 3nm process with an All-Big-Core architecture (Cortex-X925 ultra core at 3.73 GHz) and the NPU 890 for advanced generative AI. The branding emphasizes MediaTek's leadership in connectivity, showcasing the Dimensity Auto MT2739 telematics platform with 3GPP Release 17/18 NR-NTN satellite support and the first wave of Wi-Fi 8 solutions using the Filogic 8000 series chipsets. The display highlights the convergence of edge-to-cloud intelligence, including Sovereign AI for automotive cockpits and RedCap (Reduced Capability) technology for mass-market 5G IoT devices during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. (Photo by Joan Cros/NurPhoto)

Mobile World Congress MWC 2026 Barcelona technology trade show telecommunications mobile industry smartphone launch consumer electronics innovation artificial intelligence AI technology 5G 6G mobile devices tech exhibition global technology event digital economy connectivity future technology MediaTek Spain Fira Gran Via Dimensity 9500 Dimensity Auto Filogic 8000 Wi-Fi 8 5G-Advanced AI For Life NPU 890 Cortex-X925 NR-NTN Satellite Connectivity Edge AI Semiconductor Intelligent Living RedCap 3nm Chip Smart Cockpit