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Mobile World Congress
The MediaTek corporate logo is displayed at the Fira Gran Via booth with the slogan ''Complete End-to-End Solutions,'' highlighting the company's ''AI For Life'' ecosystem during the Mobile World Congress. The exhibit features the flagship Dimensity 9500 processor, built on a 3nm process with an All-Big-Core architecture (Cortex-X925 ultra core at 3.73 GHz) and the NPU 890 for advanced generative AI. The branding emphasizes MediaTek's leadership in connectivity, showcasing the Dimensity Auto MT2739 telematics platform with 3GPP Release 17/18 NR-NTN satellite support and the first wave of Wi-Fi 8 solutions using the Filogic 8000 series chipsets. The display highlights the convergence of edge-to-cloud intelligence, including Sovereign AI for automotive cockpits and RedCap (Reduced Capability) technology for mass-market 5G IoT devices during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. (Photo by Joan Cros/NurPhoto)
Photo Details
| Photo ID | #13439923 |
|---|---|
| Date Taken | |
| Location | N/A |
| Photographer | Joan Cros/NurPhoto |
| Category | Science and Technology |
| Copyright | © 2026 NurPhoto - Joan Cros/NurPhoto |
Related Keywords
Mobile World Congress
MWC 2026
Barcelona
technology trade show
telecommunications
mobile industry
smartphone launch
consumer electronics
innovation
artificial intelligence
AI technology
5G
6G
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global technology event
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connectivity
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MediaTek
Spain
Fira Gran Via
Dimensity 9500
Dimensity Auto
Filogic 8000
Wi-Fi 8
5G-Advanced
AI For Life
NPU 890
Cortex-X925
NR-NTN
Satellite Connectivity
Edge AI
Semiconductor
Intelligent Living
RedCap
3nm Chip
Smart Cockpit
2026 NurPhoto. All rights reserved.
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