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"Dimensity Auto"
403 professional editorial images found
#13439923
13 March 2026
The MediaTek corporate logo is displayed at the Fira Gran Via booth with the slogan ''Complete End-to-End Solutions,'' highlighting the company's ''AI For Life'' ecosystem during the Mobile World Congress. The exhibit features the flagship Dimensity 9500 processor, built on a 3nm process with an All-Big-Core architecture (Cortex-X925 ultra core at 3.73 GHz) and the NPU 890 for advanced generative AI. The branding emphasizes MediaTek's leadership in connectivity, showcasing the Dimensity Auto MT2739 telematics platform with 3GPP Release 17/18 NR-NTN satellite support and the first wave of Wi-Fi 8 solutions using the Filogic 8000 series chipsets. The display highlights the convergence of edge-to-cloud intelligence, including Sovereign AI for automotive cockpits and RedCap (Reduced Capability) technology for mass-market 5G IoT devices during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.
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#13439927
13 March 2026
The MediaTek corporate logo features at the Fira Gran Via booth, representing the company's ''AI For Life: From Edge to Cloud'' strategy during the Mobile World Congress. The exhibit showcases the flagship Dimensity 9500 processor, built on TSMC's 3nm (N3P) process and featuring an All Big Core architecture with a Cortex-X925 ultra-core clocked at 3.73 GHz. The display highlights the new NPU 9.0 (Neural Processing Unit) delivering 100 TOPS of computing power for on-device generative video and agentic AI. The branding encompasses the Dimensity Auto MT2739 platform for satellite-connected vehicles and the first commercial Wi-Fi 8 solutions using the Filogic 8000 series, emphasizing MediaTek's leadership in high-speed, low-latency connectivity for smartphones, IoT, and next-generation data centers during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.
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#12227008
23 May 2025
Several MediaTek chips from MediaTek Dimensity Auto Solutions, a range of new automotive solutions for car cockpits by the Taiwanese semiconductor manufacturer, are exhibited during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025.
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#12227009
23 May 2025
An Asian man tries a game feature in a car cockpit screen equipped with MediaTek Dimensity Auto Solution, a range of new automotive solutions for car cockpits by the Taiwanese semiconductor manufacturer, during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025.
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#12227010
23 May 2025
In Barcelona, Spain, on March 5, 2025, congress attendees try some of the MediaTek Dimensity Auto Solutions on a car cockpit simulator, a range of new automotive solutions for car cockpits by the Taiwanese semiconductor manufacturer, in their pavilion during the Mobile World Congress 2025.
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#12227011
23 May 2025
In Barcelona, Spain, on March 5, 2025, congress attendees try some of the MediaTek Dimensity Auto Solutions on a car cockpit simulator, a range of new automotive solutions for car cockpits by the Taiwanese semiconductor manufacturer, in their pavilion during the Mobile World Congress 2025.
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#12227013
23 May 2025
A woman from MediaTek shows two congressmen the difference between their new MediaTek Dimensity 9400 chip on an Android device and Apple's A-series chip on an iPhone during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025.
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#12227017
23 May 2025
A tri-folding screen is exhibited at the MediaTek pavilion as the Taiwanese company's new flagship chip, Dimensity 9400, includes support for scaling content across extended screens at the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025.
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#12397025
23 May 2025
A tri-folding screen is exhibited at the MediaTek pavilion as the Taiwanese company's new flagship chip, Dimensity 9400, includes support for scaling content across extended screens at the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025.
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#12397018
22 May 2025
Several MediaTek chips from MediaTek Dimensity Auto Solutions, a range of new automotive solutions for car cockpits by the Taiwanese semiconductor manufacturer, are exhibited during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025.
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#12397019
22 May 2025
An Asian man tries a game feature on a car cockpit screen equipped with MediaTek Dimensity Auto Solution, a range of new automotive solutions for car cockpits by the Taiwanese semiconductor manufacturer, during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025.
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#12397020
22 May 2025
In Barcelona, Spain, on March 5, 2025, congress attendees try some of the MediaTek Dimensity Auto Solutions on a car cockpit simulator, a range of new automotive solutions for car cockpits by the Taiwanese semiconductor manufacturer, in their pavilion during the Mobile World Congress 2025.
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#12397021
22 May 2025
In Barcelona, Spain, on March 5, 2025, congress attendees try some of the MediaTek Dimensity Auto Solutions on a car cockpit simulator, a range of new automotive solutions for car cockpits by the Taiwanese semiconductor manufacturer, in their pavilion during the Mobile World Congress 2025.
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#12397023
22 May 2025
A woman from MediaTek shows two congressmen the difference between their new MediaTek Dimensity 9400 chip on an Android device and Apple's A-series chip on an iPhone during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025.
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#13439921
13 March 2026
The Cisco corporate logo features prominently at the Fira Gran Via, highlighting the company's focus on AI-native networking and cybersecurity during the Mobile World Congress. The exhibit showcases the Cisco Silicon One G200 and G202 processors, which power the next generation of high-density switches for AI back-end networks with up to 51.2 Tbps of switching capacity. The display highlights the integration of Cisco Hypershield and Splunk analytics for AI-driven threat detection and automated network management. Visitors explore the Cisco ThousandEyes platform for end-to-end visibility in 5G-Advanced and Wi-Fi 7 environments, while the pavilion emphasizes sustainable data center solutions using Liquid Cooling and Cisco UCS servers equipped with the latest Intel Xeon 6 processors during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.
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Parked Cars Lining Residential Street In Munich Shows Limited Parking Space And High Car Density
11 March 2026
#13432302
11 March 2026
Rows of parked cars line a residential street in Munich, Bavaria, Germany, on March 11, 2026. Limited parking space and high car density are common challenges in large European cities.
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