"mobile features."

#13439921

13 March 2026

The Cisco corporate logo features prominently at the Fira Gran Via, highlighting the company's focus on AI-native networking and cybersecurity during the Mobile World Congress. The exhibit showcases the Cisco Silicon One G200 and G202 processors, which power the next generation of high-density switches for AI back-end networks with up to 51.2 Tbps of switching capacity. The display highlights the integration of Cisco Hypershield and Splunk analytics for AI-driven threat detection and automated network management. Visitors explore the Cisco ThousandEyes platform for end-to-end visibility in 5G-Advanced and Wi-Fi 7 environments, while the pavilion emphasizes sustainable data center solutions using Liquid Cooling and Cisco UCS servers equipped with the latest Intel Xeon 6 processors during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.

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#13439927

13 March 2026

The MediaTek corporate logo features at the Fira Gran Via booth, representing the company's ''AI For Life: From Edge to Cloud'' strategy during the Mobile World Congress. The exhibit showcases the flagship Dimensity 9500 processor, built on TSMC's 3nm (N3P) process and featuring an All Big Core architecture with a Cortex-X925 ultra-core clocked at 3.73 GHz. The display highlights the new NPU 9.0 (Neural Processing Unit) delivering 100 TOPS of computing power for on-device generative video and agentic AI. The branding encompasses the Dimensity Auto MT2739 platform for satellite-connected vehicles and the first commercial Wi-Fi 8 solutions using the Filogic 8000 series, emphasizing MediaTek's leadership in high-speed, low-latency connectivity for smartphones, IoT, and next-generation data centers during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.

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#13439888

13 March 2026

A close-up of the Samsung Agentic AI branding at the MWC 2026 booth symbolizes a shift from reactive tools to autonomous AI agents that anticipate user intent without explicit commands. The logo is showcased alongside the Galaxy S26 Ultra, which features a 200-megapixel main sensor with wider apertures and the HiSilicon-integrated NPU (or Samsung's proprietary NPU) capable of processing multimodal AI tasks locally. The ''Agentic'' vision is supported by the Snapdragon 8 Elite platform's Hexagon processor, enabling complex decision-making for personalized health insights and proactive device management across the HarmonyOS-integrated (or Android 16-based) Galaxy ecosystem during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.

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#13439909

13 March 2026

The current Intel corporate logo uses its modern, minimalist ''intel'' typeface, rendered in the distinctive ''Intel Blue.'' This visual identity, introduced as part of the ''One Intel'' brand refresh, features a clean, sans-serif font without the traditional surrounding circle or ''swoosh.'' The simplified design emphasizes connectivity, innovation, and a forward-looking technological vision. As a staple at events like MWC 2026, this branding represents Intel's expansion from a ''CPU company'' into an integrated data, AI, and connectivity leader, symbolizing its central role in the digital infrastructure during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13439910

13 March 2026

The Intel corporate logo is showcased at the Fira Gran Via booth, highlighting the company's role in the ''AI Everywhere'' era during the Mobile World Congress. The exhibit features the latest Intel Core Ultra 300 (Series 3) processors with integrated NPU 5.0, delivering over 50 TOPS for local generative AI processing. The display highlights the Intel Xeon 6 processors with P-cores and E-cores for optimized telecom workloads and the Intel vPro platform's new security features for AI-ready enterprise fleets. Visitors observe demonstrations of the OpenVINO 2026.0 toolkit for cross-architectural AI deployment and the Intel Gaudi 4 AI accelerator, designed to compete in the large-scale LLM training and inference market for sovereign cloud providers during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.

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#13439911

13 March 2026

The Intel corporate logo is showcased at the Fira Gran Via booth, highlighting the company's role in the ''AI Everywhere'' era during the Mobile World Congress. The exhibit features the latest Intel Core Ultra 300 (Series 3) processors with integrated NPU 5.0, delivering over 50 TOPS for local generative AI processing. The display highlights the Intel Xeon 6 processors with P-cores and E-cores for optimized telecom workloads and the Intel vPro platform's new security features for AI-ready enterprise fleets. Visitors observe demonstrations of the OpenVINO 2026.0 toolkit for cross-architectural AI deployment and the Intel Gaudi 4 AI accelerator, designed to compete in the large-scale LLM training and inference market for sovereign cloud providers during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.

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#13439923

13 March 2026

The MediaTek corporate logo is displayed at the Fira Gran Via booth with the slogan ''Complete End-to-End Solutions,'' highlighting the company's ''AI For Life'' ecosystem during the Mobile World Congress. The exhibit features the flagship Dimensity 9500 processor, built on a 3nm process with an All-Big-Core architecture (Cortex-X925 ultra core at 3.73 GHz) and the NPU 890 for advanced generative AI. The branding emphasizes MediaTek's leadership in connectivity, showcasing the Dimensity Auto MT2739 telematics platform with 3GPP Release 17/18 NR-NTN satellite support and the first wave of Wi-Fi 8 solutions using the Filogic 8000 series chipsets. The display highlights the convergence of edge-to-cloud intelligence, including Sovereign AI for automotive cockpits and RedCap (Reduced Capability) technology for mass-market 5G IoT devices during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.

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#13439924

13 March 2026

A reference smartphone powered by the MediaTek Dimensity 9500 chipset is displayed at the Fira Gran Via, demonstrating the ''Dimensity AI Telephoto'' generative imaging technology. The device features a specialized 200-megapixel Samsung ISOCELL HP5 main sensor and a 50-megapixel periscope telephoto lens with 5x optical and 100x digital zoom capabilities. The hardware utilizes the integrated NPU 890 and the Imagiq 10 ISP (Image Signal Processor) to execute real-time AI Super Resolution and generative texture reconstruction, which intelligently fills in missing visual data at high magnification levels. The exhibit highlights the chipset's All-Big-Core architecture, featuring the Cortex-X925 core running at 3.73 GHz, which manages the complex computational photography pipelines required for stable 4K video capture at 10x hybrid zoom during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.

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#13439925

13 March 2026

A reference smartphone powered by the MediaTek Dimensity 9500 chipset is displayed at the Fira Gran Via, demonstrating the ''Dimensity AI Telephoto'' generative imaging technology. The device features a specialized 200-megapixel Samsung ISOCELL HP5 main sensor and a 50-megapixel periscope telephoto lens with 5x optical and 100x digital zoom capabilities. The hardware utilizes the integrated NPU 890 and the Imagiq 10 ISP (Image Signal Processor) to execute real-time AI Super Resolution and generative texture reconstruction, which intelligently fills in missing visual data at high magnification levels. The exhibit highlights the chipset's All-Big-Core architecture, featuring the Cortex-X925 core running at 3.73 GHz, which manages the complex computational photography pipelines required for stable 4K video capture at 10x hybrid zoom during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.

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#13439926

13 March 2026

The UniFi brand logo is showcased at the Ubiquiti booth in Hall 2 of the Fira Gran Via, highlighting the company's ''IT Simplified'' philosophy during the Mobile World Congress. The exhibit features the latest Cloud Gateway Max and Enterprise Fortress Gateway (EFG), powered by an 8-core ARM Cortex-A57 processor at 2.5 GHz, designed to handle 25Gbps routing with full inspection. The display showcases the U7 Pro Max access points, which utilize the 6 GHz band with Wi-Fi 7 technology and Multi-Link Operation (MLO) for ultra-low latency. The branding emphasizes the integration of UniFi Protect AI-driven surveillance, featuring the G5 Pro cameras with 12-megapixel 4K sensors and advanced human/vehicle recognition running locally on the UniFi OS ecosystem without cloud dependence during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.

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#13439929

13 March 2026

The humanoid robot Pepper interacts with attendees at the Fira Gran Via during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. This version of the social robot features an upgraded hardware architecture powered by the Qualcomm Robotics RB5 Platform, which includes a specialized NPU (Neural Processing Unit) enabling on-device generative AI capabilities for natural language processing and emotional recognition. The robot utilizes a multimodal sensor array, including a custom 12-megapixel HDR depth camera for facial tracking and spatial awareness, working alongside a 2D 5-megapixel wide-angle camera and an Omnidirectional Microphone Array with AI Beamforming technology for multi-user voice localization. Connectivity is managed via a dedicated Wi-Fi 7 and 5G-Advanced module, allowing seamless cloud synchronization with external LLM (Large Language Model) agents to provide real-time, personalized information and advanced navigation across the bustling venue.

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#13439936

13 March 2026

The official 6G logo is displayed at the Qualcomm booth in Hall 3 of the Fira Gran Via, marking the company's leadership in AI-native wireless research during the Mobile World Congress. The exhibit features an end-to-end 6G prototype system utilizing Giga-MIMO technology with 2,048 antenna elements to maximize spectral efficiency in the 7 GHz and 13 GHz bands. Powered by the Qualcomm X105 5G-Advanced Modem-RF system as a foundational bridge, the demonstration highlights sub-band full duplex and probabilistic shaping techniques to achieve peak data rates exceeding 14.8 Gbps. The display showcases how 6G integrates sensing and communication to enable Digital Twins and autonomous vehicle orchestration, supported by Intel Xeon 6 edge servers and Qualcomm's specialized NPU-driven air interface that adapts to real-world RF environments in real-time during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.

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#13439937

13 March 2026

The official 6G logo is displayed at the Qualcomm booth in Hall 3 of the Fira Gran Via, marking the company's leadership in AI-native wireless research during the Mobile World Congress. The exhibit features an end-to-end 6G prototype system utilizing Giga-MIMO technology with 2,048 antenna elements to maximize spectral efficiency in the 7 GHz and 13 GHz bands. Powered by the Qualcomm X105 5G-Advanced Modem-RF system as a foundational bridge, the demonstration highlights sub-band full duplex and probabilistic shaping techniques to achieve peak data rates exceeding 14.8 Gbps. The display showcases how 6G integrates sensing and communication to enable Digital Twins and autonomous vehicle orchestration, supported by Intel Xeon 6 edge servers and Qualcomm's specialized NPU-driven air interface that adapts to real-world RF environments in real-time during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.

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#13439939

13 March 2026

A close-up view of the innovative Honor Robot Phone is showcased at the Honor booth. This ''new species'' of smartphone features a revolutionary 200-megapixel main camera sensor integrated into an industry-first 4DoF (four degrees of freedom) motorized gimbal system. The device, powered by the Qualcomm Snapdragon 8 Elite Gen 5 processor, utilizes on-device AI and specialized micro-motors, which are 70% smaller than standard gimbals, to perform autonomous subject tracking, rhythmic movement, and expressive gestures like nodding. The hardware includes a high-durability titanium alloy mechanical arm and a high-capacity silicon-carbon anode battery to support the motorized components during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13439940

13 March 2026

A congress assistant tests the innovative Honor Robot Phone showcased at the Honor booth. This ''new species'' of smartphone features a revolutionary 200-megapixel main camera sensor integrated into an industry-first 4DoF (four degrees of freedom) motorized gimbal system. The device, powered by the Qualcomm Snapdragon 8 Elite Gen 5 processor, utilizes on-device AI and specialized micro-motors--70% smaller than standard gimbals--to perform autonomous subject tracking, rhythmic movement, and expressive gestures like nodding. The hardware includes a high-durability titanium alloy mechanical arm and a high-capacity silicon-carbon anode battery to support the motorized components during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13439941

13 March 2026

A close-up view of the innovative Honor Robot Phone is showcased at the Honor booth. This ''new species'' of smartphone features a revolutionary 200-megapixel main camera sensor integrated into an industry-first 4DoF (four degrees of freedom) motorized gimbal system. The device, powered by the Qualcomm Snapdragon 8 Elite Gen 5 processor, utilizes on-device AI and specialized micro-motors, which are 70% smaller than standard gimbals, to perform autonomous subject tracking, rhythmic movement, and expressive gestures like nodding. The hardware includes a high-durability titanium alloy mechanical arm and a high-capacity silicon-carbon anode battery to support the motorized components during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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