Search Editorial Photos
"module chip"
26 professional editorial images found
#12685358
28 August 2025
In Barcelona, Spain, on March 5, 2025, a Vslam demonstration, the Visual Simultaneous Location and Mapping technology that allows a robot or other system to simultaneously determine its position in an environment, takes place by the Chinese supplier of cellular modules and solutions MeiG Smart Technology during the Mobile World Congress 2025.
Restricted to Editorial Use Only.
Commercial use is not permitted without prior authorization.
Please contact us for more information.
#12227019
23 May 2025
The Compal RML-NV2 Module chip, a chip by the Taiwanese company Compal and the semiconductor manufacturer MediaTek, is exhibited during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025.
Restricted to Editorial Use Only.
Commercial use is not permitted without prior authorization.
Please contact us for more information.
#12227018
23 May 2025
The Fibocom FG332, a 3GPP R17 module chip by the Chinese company together with the Taiwanese semiconductor manufacturer MediaTek designed for 5G IoT applications, is exhibited during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025.
Restricted to Editorial Use Only.
Commercial use is not permitted without prior authorization.
Please contact us for more information.
#12227015
23 May 2025
The Quectel RG225G, a 5G RedCap MediaTek-based module chip developed by the Taiwanese semiconductor company together with the Canadian Quectel Wireless Solutions, is exhibited during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025.
Restricted to Editorial Use Only.
Commercial use is not permitted without prior authorization.
Please contact us for more information.
#12397028
22 May 2025
The Compal RML-NV2 Module chip, a chip by the Taiwanese company Compal and the semiconductor manufacturer MediaTek, is exhibited during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025.
Restricted to Editorial Use Only.
Commercial use is not permitted without prior authorization.
Please contact us for more information.
#12397027
22 May 2025
The Fibocom FG332, a 3GPP R17 module chip by the Chinese company together with the Taiwanese semiconductor manufacturer MediaTek designed for 5G IoT applications, is exhibited during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025.
Restricted to Editorial Use Only.
Commercial use is not permitted without prior authorization.
Please contact us for more information.
#12397026
22 May 2025
The Quectel RG225G, a 5G RedCap MediaTek-based module chip developed by the Taiwanese semiconductor company together with the Canadian Quectel Wireless Solutions, is exhibited during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025.
Restricted to Editorial Use Only.
Commercial use is not permitted without prior authorization.
Please contact us for more information.
#12238797
7 April 2025
LAS VEGAS, USA - JANUARY 08: A detailed look at a PC computer equipped with an Intel Core processor, Intel Arc graphics processing units, and CORSAIR Dominator Titanium DDR5 Memory on display at the Consumer Electronics Show (CES) 2025, in Las Vegas, Nevada, USA, on January 8 2025.
Restricted to Editorial Use Only.
Commercial use is not permitted without prior authorization.
Please contact us for more information.
#10904500
11 January 2024
A worker is checking crystal displays and modules on a production line at a semiconductor production workshop in Gao'an, Jiangxi Province, China, on January 10, 2024.
Restricted to Editorial Use Only.
Commercial use is not permitted without prior authorization.
Please contact us for more information.
#10377682
16 August 2023
GUIYANG, CHINA - AUGUST 16, 2023 - A staff member displays a 1-inch four-color module display in Guiyang, Guizhou province, China, Aug. 16, 2023.
Restricted to Editorial Use Only.
Commercial use is not permitted without prior authorization.
Please contact us for more information.