"platform ecosystem"

#13439930

13 March 2026

The Starlink corporate logo, part of the SpaceX ecosystem, is seen against a clear blue sky at the Fira Gran Via in Barcelona, Spain, on March 5, 2026. It represents the global expansion of the Starlink Gen2 satellite constellation during the Mobile World Congress. The exhibit showcases the new Starlink Standard Kit (V4) and the Flat High Performance terminal, powered by a custom quad-core ARM-based Starlink SoC designed for low-power beamforming and phased-array antenna management. The branding highlights the commercial launch of Direct-to-Cell services, utilizing the LTE/5G-Advanced spectrum to provide emergency messaging and data connectivity directly to unmodified smartphones through eNodeB satellite payloads. Visitors explore the integration of the Starlink Mobility platform with Wi-Fi 7 routers, offering download speeds exceeding 300 Mbps and latencies below 25ms for remote industrial and maritime applications.

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#13439897

13 March 2026

The Microsoft Copilot logo is displayed at the Fira Gran Via during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. The platform evolves into a proactive Agentic AI ecosystem, and the branding highlights the integration of Work IQ and Agent Mode across Microsoft 365 apps, powered by foundational models like GPT-5 and Azure OpenAI Foundry. The exhibit showcases the synergy between the software and the latest Copilot+ PC hardware, including devices equipped with the Snapdragon X Plus (8-core) processor and the AMD Ryzen AI 400 series, both featuring dedicated Neural Processing Units (NPUs) capable of 45 to 50 TOPS for on-device AI tasks. The display also features the Surface Pro 12-inch, which integrates a 10-megapixel Ultra HD rear camera and a Full HD front-facing Studio Camera with AI-enhanced Windows Studio Effects, all operating under the unified Copilot intelligence layer.

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#13439908

13 March 2026

The Snapdragon corporate logo is illuminated at the Qualcomm pavilion in Hall 3 of the Fira Gran Via, representing the launch of the Snapdragon 8 Elite Gen 5 (SM8850-AC) mobile platform during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. The 3nm architecture processor features the new Oryon V3 CPU and an enhanced Hexagon NPU capable of delivering over 80 TOPS for on-device generative AI. The branding highlights the expansion of the Snapdragon ecosystem into automotive with the Snapdragon Cockpit Elite and computing with the Snapdragon X Elite Gen 2, which powers the latest Windows 11 Copilot+ PCs. The exhibit showcases seamless multimodal AI processing across smartphones, XR glasses, and connected vehicles, emphasizing the Qualcomm AI Stack and ultra-low latency 5G-Advanced connectivity through the Snapdragon X85 Modem-RF System.

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#13439923

13 March 2026

The MediaTek corporate logo is displayed at the Fira Gran Via booth with the slogan ''Complete End-to-End Solutions,'' highlighting the company's ''AI For Life'' ecosystem during the Mobile World Congress. The exhibit features the flagship Dimensity 9500 processor, built on a 3nm process with an All-Big-Core architecture (Cortex-X925 ultra core at 3.73 GHz) and the NPU 890 for advanced generative AI. The branding emphasizes MediaTek's leadership in connectivity, showcasing the Dimensity Auto MT2739 telematics platform with 3GPP Release 17/18 NR-NTN satellite support and the first wave of Wi-Fi 8 solutions using the Filogic 8000 series chipsets. The display highlights the convergence of edge-to-cloud intelligence, including Sovereign AI for automotive cockpits and RedCap (Reduced Capability) technology for mass-market 5G IoT devices during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.

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#13439932

13 March 2026

The Meta corporate logo is featured at the Fira Gran Via booth, highlighting the company's ''AI-First'' hardware ecosystem during the Mobile World Congress. The exhibit showcases the Ray-Ban Meta Display (Gen 3) smart glasses, which feature a 12-megapixel ultra-wide camera for multimodal AI environment analysis and a micro-LED heads-up display etched into the right lens. The hardware is powered by the Qualcomm Snapdragon AR1 Gen 2 platform, enabling real-time language translation and ''Look and Ask'' visual search via the Llama 4 model. The display also features the Meta Quest 4 (codenamed ''Pismo High''), which utilizes the Snapdragon XR2 Gen 3 chipset and dual 24-megapixel 4K passthrough cameras for high-fidelity mixed reality experiences. The booth demonstrates the Neural Band (EMG) wearable for gesture-based control and the prototype Orion AR glasses with a 70-degree field of view and silicon carbide lenses during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.

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#13439888

13 March 2026

A close-up of the Samsung Agentic AI branding at the MWC 2026 booth symbolizes a shift from reactive tools to autonomous AI agents that anticipate user intent without explicit commands. The logo is showcased alongside the Galaxy S26 Ultra, which features a 200-megapixel main sensor with wider apertures and the HiSilicon-integrated NPU (or Samsung's proprietary NPU) capable of processing multimodal AI tasks locally. The ''Agentic'' vision is supported by the Snapdragon 8 Elite platform's Hexagon processor, enabling complex decision-making for personalized health insights and proactive device management across the HarmonyOS-integrated (or Android 16-based) Galaxy ecosystem during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.

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#13439906

13 March 2026

The Salesforce corporate logo is seen against a clear blue sky at the Salesforce Garden outdoor pavilion during the Mobile World Congress at Fira Gran Via. The 900-square-meter exhibition space serves as the hub for the ''Agentic Enterprise'' showcase, featuring live demonstrations of Agentforce, the company's autonomous AI platform powered by Data Cloud and Atlas Reasoning Engine. The exhibit highlights specialized AI agents for the telecommunications industry, including Agentforce for Communications, designed to automate complex customer lifecycles and network sales. Visitors explore the integration of Slack AI and Tableau Pulse on high-performance infrastructure, while the pavilion emphasizes sustainability and the transition from predictive to generative and autonomous AI workflows in the Customer 360 ecosystem during the Mobile World Congress in Barcelona, Spain, on March 5, 2026.

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#13439938

13 March 2026

The Honor HyperBot humanoid robot performs a synchronized dance routine with two professional dancers at the Fira Gran Via, surrounded by a crowd of attendees capturing the moment with their smartphones during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. The robot's agile movements and real-time synchronization are powered by the Qualcomm Robotics RB5 Platform, utilizing an integrated NPU for advanced motion control and environment sensing. Equipped with a multimodal sensor array, including a 12-megapixel Intel RealSense depth camera and a high-resolution 2D 5-megapixel camera for facial tracking, the HyperBot demonstrates seamless human-robot interaction over a low-latency 5G-Advanced network. The demonstration highlights Honor's expansion into AI-driven robotics and its MagicOS ecosystem integration, showcasing the robot's ability to interpret and respond to complex behavioral cues within a high-density environment.

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#13439957

13 March 2026

The iconic T-Mobile (Deutsche Telekom) ''T'' logo illuminates in magenta at the company's main exhibition pavilion during the Mobile World Congress in Barcelona, Spain, on March 5, 2026. For the 2026 edition, the brand showcases its ''Magenta AI'' ecosystem, highlighting the transition toward AI-native 6G networks. The stand features the world premiere of an AI-powered call assistant that operates at the network level without requiring local apps, alongside the MIA (Mobile Intelligent Assistant) life-size 3D avatar powered by a custom Large Language Model (LLM) for real-time visitor interaction. Technical demonstrations at the booth, supported by the NVIDIA AI Aerial platform and Qualcomm Snapdragon 8 Gen 5 integrated systems, showcase the first commercial-ready AI-RAN (Radio Access Network) architecture designed to optimize 5G-Advanced spectral efficiency.

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#13413347

7 March 2026

The KDDI corporate logo represents the Japanese telecommunications leader showcasing its ?U (AlphaU) metaverse ecosystem and AI-driven retail solutions integrated with the Snapdragon 8 Elite Gen 5 mobile platform for on-device processing. It is pictured at their innovative exhibition space focused on Sustainable Digital Twins and Web3 infrastructure during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13413350

7 March 2026

The TECNO Modular Phone Concept, an ultra-slim 4.9mm smartphone featuring Modular Magnetic Interconnection Technology and the Snapdragon 8 Elite Gen 5 platform, is exhibited with its stackable ecosystem, including a 50-megapixel action camera module and a 10-20x telephoto optical lens attachment, as the manufacturer demonstrates high-bandwidth mmWave connectivity between the core device and its hardware peripherals during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13413351

7 March 2026

The TECNO Modular Phone Concept, an ultra-slim 4.9mm smartphone featuring Modular Magnetic Interconnection Technology and the Snapdragon 8 Elite Gen 5 platform, is exhibited with its stackable ecosystem, including a 50-megapixel action camera module and a 10-20x telephoto optical lens attachment, as the manufacturer demonstrates high-bandwidth mmWave connectivity between the core device and its hardware peripherals during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13413352

7 March 2026

The TECNO Modular Phone Concept, an ultra-slim 4.9mm smartphone featuring Modular Magnetic Interconnection Technology and the Snapdragon 8 Elite Gen 5 platform, is exhibited with its stackable ecosystem, including a 50-megapixel action camera module and a 10-20x telephoto optical lens attachment, as the manufacturer demonstrates high-bandwidth mmWave connectivity between the core device and its hardware peripherals during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13413353

7 March 2026

The TECNO Modular Phone Concept, an ultra-slim 4.9mm smartphone featuring Modular Magnetic Interconnection Technology and the Snapdragon 8 Elite Gen 5 platform, is exhibited with its stackable ecosystem, including a 50-megapixel action camera module and a 10-20x telephoto optical lens attachment, as the manufacturer demonstrates high-bandwidth mmWave connectivity between the core device and its hardware peripherals during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13413354

7 March 2026

The TECNO Modular Phone Concept, an ultra-slim 4.9mm smartphone featuring Modular Magnetic Interconnection Technology and the Snapdragon 8 Elite Gen 5 platform, is exhibited with its stackable ecosystem, including a 50-megapixel action camera module and a 10-20x telephoto optical lens attachment, as the manufacturer demonstrates high-bandwidth mmWave connectivity between the core device and its hardware peripherals during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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#13413764

7 March 2026

The Antigravity A1 360-degree drone and Vision Goggles FPV headset demonstrate a dual 1/1.28-inch CMOS sensor system capable of 8K resolution video at 30 fps and 55-megapixel still images with invisible drone technology at the Fira Gran Via exhibition. The ecosystem is powered by the Qualcomm Snapdragon AR1 Gen 1 platform within the goggles and uses the OmniLink 360 transmission system for ultra-low latency head-tracking. It highlights its dual 2.5K Micro-OLED displays with pancake optics and the intuitive Grip motion controller for point-to-fly navigation during the Mobile World Congress (MWC) in Barcelona, Spain, on March 5, 2026.

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