Search Editorial Photos
"next-generation chips"
10 professional editorial images found
#12895444
22 October 2025
SK hynix showcases its next-generation modular memory, SOCAMM2 (right) and LPCAMM2 (left), at the Korea Semiconductor Exhibition (SEDEX 2025) at COEX in Seoul, South Korea, on October 22, 2025. The nation's largest semiconductor trade show features leading Korean chipmakers such as Samsung Electronics and SK hynix, along with global semiconductor manufacturers and equipment companies, attracting more than 60,000 visitors annually.
Restricted to Editorial Use Only.
Commercial use is not permitted without prior authorization.
Please contact us for more information.
#12895445
22 October 2025
SK hynix showcases its next-generation modular memory, SOCAMM2 (right) and LPCAMM2 (left), at the Korea Semiconductor Exhibition (SEDEX 2025) at COEX in Seoul, South Korea, on October 22, 2025. The nation's largest semiconductor trade show features leading Korean chipmakers such as Samsung Electronics and SK hynix, along with global semiconductor manufacturers and equipment companies, attracting more than 60,000 visitors annually.
Restricted to Editorial Use Only.
Commercial use is not permitted without prior authorization.
Please contact us for more information.
#12685550
28 August 2025
In Barcelona, Spain, on March 5, 2025, a close-up of Qualcomm chipset components, including the X82 5G M.2 module and the LGA module, showcases cutting-edge technology for high-speed connectivity and advanced performance in next-generation devices. These components are exhibited in the Qualcomm pavilion during the Mobile World Congress 2025.
Restricted to Editorial Use Only.
Commercial use is not permitted without prior authorization.
Please contact us for more information.
#12685551
28 August 2025
In Barcelona, Spain, on March 5, 2025, a close-up of Qualcomm chipset components, the X82 5G LGA Module, showcases cutting-edge technology for high-speed connectivity and advanced performance in next-generation devices. It is exhibited in the Qualcomm pavilion during the Mobile World Congress 2025.
Restricted to Editorial Use Only.
Commercial use is not permitted without prior authorization.
Please contact us for more information.
#12685552
28 August 2025
In Barcelona, Spain, on March 5, 2025, a close-up of Qualcomm chipset components, the X82 5G M.2 Module, showcases cutting-edge technology for high-speed connectivity and advanced performance in next-generation devices. It is exhibited in the Qualcomm pavilion during the Mobile World Congress 2025.
Restricted to Editorial Use Only.
Commercial use is not permitted without prior authorization.
Please contact us for more information.
#12685571
28 August 2025
In Barcelona, Spain, on March 5, 2025, a close-up of Fibocom chipset components, including the FG200-NA and FG131-NA modules, highlights advanced 5G connectivity and IoT-ready technology for next-generation smart devices. These components are exhibited in the Qualcomm pavilion during the Mobile World Congress 2025.
Restricted to Editorial Use Only.
Commercial use is not permitted without prior authorization.
Please contact us for more information.
#12227023
23 May 2025
The model of a satellite is displayed over the MediaTek 6G Logo, one of the future projects of the Taiwanese semiconductor manufacturer to offer pervasive global connectivity, during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025.
Restricted to Editorial Use Only.
Commercial use is not permitted without prior authorization.
Please contact us for more information.
#12227017
23 May 2025
A tri-folding screen is exhibited at the MediaTek pavilion as the Taiwanese company's new flagship chip, Dimensity 9400, includes support for scaling content across extended screens at the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025.
Restricted to Editorial Use Only.
Commercial use is not permitted without prior authorization.
Please contact us for more information.
#12397031
22 May 2025
An image of MediaTek's flagship chip, the MediaTek Dimensity 9400, an all-big core CPI designed for AI-equipped smartphones by the Taiwanese semiconductor manufacturer, is displayed during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025.
Restricted to Editorial Use Only.
Commercial use is not permitted without prior authorization.
Please contact us for more information.
#12238802
7 April 2025
LAS VEGAS, USA - JANUARY 08: Intel presents its Core Ultra 9 chip during CES 2025 in Las Vegas, at the Consumer Electronics Show (CES) 2025, in Las Vegas, Nevada, USA, on January 8 2025.
Restricted to Editorial Use Only.
Commercial use is not permitted without prior authorization.
Please contact us for more information.