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"wireless module"
17 professional editorial images found
#13764913
30 May 2026
An Arduino UNO R4 WiFi development board is seen from above in Bari, Italy, on May 23, 2026, featuring the Renesas RA4M1 microcontroller, digital pin headers, and ESP32-S3 wireless module. The Arduino UNO R4 WiFi is the fourth generation of the Arduino UNO platform and the first to include onboard wireless connectivity, designed for IoT applications and advanced maker projects.
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#12685584
28 Aug 2025
The MEiglink SRM819W module features advanced wireless connectivity technology designed for high-performance applications in IoT and smart devices. It is exhibited in the Qualcomm pavilion during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025.
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#12685551
28 Aug 2025
In Barcelona, Spain, on March 5, 2025, a close-up of Qualcomm chipset components, the X82 5G LGA Module, showcases cutting-edge technology for high-speed connectivity and advanced performance in next-generation devices. It is exhibited in the Qualcomm pavilion during the Mobile World Congress 2025.
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#12685552
28 Aug 2025
In Barcelona, Spain, on March 5, 2025, a close-up of Qualcomm chipset components, the X82 5G M.2 Module, showcases cutting-edge technology for high-speed connectivity and advanced performance in next-generation devices. It is exhibited in the Qualcomm pavilion during the Mobile World Congress 2025.
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#12685571
28 Aug 2025
In Barcelona, Spain, on March 5, 2025, a close-up of Fibocom chipset components, including the FG200-NA and FG131-NA modules, highlights advanced 5G connectivity and IoT-ready technology for next-generation smart devices. These components are exhibited in the Qualcomm pavilion during the Mobile World Congress 2025.
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#12227015
23 May 2025
The Quectel RG225G, a 5G RedCap MediaTek-based module chip developed by the Taiwanese semiconductor company together with the Canadian Quectel Wireless Solutions, is exhibited during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025.
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#12227018
23 May 2025
The Fibocom FG332, a 3GPP R17 module chip by the Chinese company together with the Taiwanese semiconductor manufacturer MediaTek designed for 5G IoT applications, is exhibited during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025.
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#12397026
22 May 2025
The Quectel RG225G, a 5G RedCap MediaTek-based module chip developed by the Taiwanese semiconductor company together with the Canadian Quectel Wireless Solutions, is exhibited during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025.
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#12397027
22 May 2025
The Fibocom FG332, a 3GPP R17 module chip by the Chinese company together with the Taiwanese semiconductor manufacturer MediaTek designed for 5G IoT applications, is exhibited during the Mobile World Congress 2025 in Barcelona, Spain, on March 5, 2025.
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#11973699
23 Jan 2025
In Rosenheim, Upper Bavaria, Bavaria, Germany, on January 19, 2025, Ericsson operates a branch for the Ericsson Antenna System.
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#11973700
23 Jan 2025
In Rosenheim, Upper Bavaria, Bavaria, Germany, on January 19, 2025, Ericsson operates a branch for the Ericsson Antenna System.
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#11973701
23 Jan 2025
In Rosenheim, Upper Bavaria, Bavaria, Germany, on January 19, 2025, Ericsson operates a branch for the Ericsson Antenna System.
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#11973702
23 Jan 2025
In Rosenheim, Upper Bavaria, Bavaria, Germany, on January 19, 2025, Ericsson operates a branch for the Ericsson Antenna System.
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#11973703
23 Jan 2025
In Rosenheim, Upper Bavaria, Bavaria, Germany, on January 19, 2025, Ericsson operates a branch for the Ericsson Antenna System.
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#11163992
21 Apr 2024
EDMONTON, CANADA - APRIL 20: An image of a woman holding a cell phone in front of a Grok logo displayed on a computer screen, on April 20, 2024, in Edmonton, Canada.
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#11163987
21 Apr 2024
EDMONTON, CANADA - APRIL 20: An image of a woman holding a cell phone in front of a Grok logo displayed on a computer screen, on April 20, 2024, in Edmonton, Canada.
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