module chip editorial photos & news images

27 images

An On-Delivery autonomous delivery robot navigates the Nokia booth at the Fira Gran Via, demonstrating integrated 5G-Advanced logistics solu...
Mobile World Congress · Barcelona, Spain © Joan Cros/NurPhoto
The sensor module chip of Next Chip company product is displayed at FIX 2025 at EXCO in Daegu, South Korea, on October 24, 2025. The 2025 Fu...
2025FIX Exhibition · Daegu, South Korea © Seung-il Ryu/NurPhoto
In Barcelona, Spain, on March 5, 2025, a close-up of Qualcomm chipset components, including the X82 5G M.2 module and the LGA module, showca...
Technology Trade Show · Barcelona, Spain © Joan Cros/NurPhoto
In Barcelona, Spain, on March 5, 2025, a close-up of Qualcomm chipset components, the X82 5G LGA Module, showcases cutting-edge technology f...
Technology Trade Show · Barcelona, Spain © Joan Cros/NurPhoto
In Barcelona, Spain, on March 5, 2025, a close-up of Qualcomm chipset components, the X82 5G M.2 Module, showcases cutting-edge technology f...
Technology Trade Show · Barcelona, Spain © Joan Cros/NurPhoto
The MEiglink SRM819W module features advanced wireless connectivity technology designed for high-performance applications in IoT and smart d...
Technology Trade Show · Barcelona, Spain © Joan Cros/NurPhoto
The Compal RML-NV2 Module chip, a chip by the Taiwanese company Compal and the semiconductor manufacturer MediaTek, is exhibited during the...
Mobile World Congress Barcelona 2025 · Barcelona, Spain © Joan Cros/NurPhoto
The Fibocom FG332, a 3GPP R17 module chip by the Chinese company together with the Taiwanese semiconductor manufacturer MediaTek designed fo...
Mobile World Congress Barcelona 2025 · Barcelona, Spain © Joan Cros/NurPhoto
The Quectel RG225G, a 5G RedCap MediaTek-based module chip developed by the Taiwanese semiconductor company together with the Canadian Quect...
Mobile World Congress Barcelona 2025 · Barcelona, Spain © Joan Cros/NurPhoto
The Compal RML-NV2 Module chip, a chip by the Taiwanese company Compal and the semiconductor manufacturer MediaTek, is exhibited during the...
Technology Trade Show · Barcelona, Spain © Joan Cros/NurPhoto
The Fibocom FG332, a 3GPP R17 module chip by the Chinese company together with the Taiwanese semiconductor manufacturer MediaTek designed fo...
Technology Trade Show · Barcelona, Spain © Joan Cros/NurPhoto
The Quectel RG225G, a 5G RedCap MediaTek-based module chip developed by the Taiwanese semiconductor company together with the Canadian Quect...
Technology Trade Show · Barcelona, Spain © Joan Cros/NurPhoto
GUIYANG, CHINA - AUGUST 16, 2023 - A staff member displays a 1-inch four-color module display in Guiyang, Guizhou province, China, Aug. 16,...
China Electronic Information Manufacturing Industry · Guiyang, China © Costfoto/NurPhoto
The Onsemi logo is displayed on a mobile phone with the company branding visible in the background, in this photo illustration in Brussels,...
Onsemi - Photo Illustration · Brussels, Belgium © Jonathan Raa/NurPhoto
The Onsemi logo is displayed on a mobile phone with the company branding visible in the background, in this photo illustration in Brussels,...
Onsemi - Photo Illustration · Brussels, Belgium © Jonathan Raa/NurPhoto
The Onsemi logo is displayed on a mobile phone with the company branding visible in the background, in this photo illustration in Brussels,...
Onsemi - Photo Illustration · Brussels, Belgium © Jonathan Raa/NurPhoto